End-Capped Polyimide for Low-Temperature Inkjet Printing
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Solution Overview
Problem
Current polyimide polymers used in electronics have limited solubility in moderate polarity solvents, leading to poor film formation and clogging issues in inkjet printing, and high-temperature curing can damage substrates and equipment.
Innovation Solution
Development of end-capped polyimide polymers with indane-containing moieties and masked maleimide groups that undergo cycloreversion reactions at low temperatures, allowing for high solubility in moderate polarity solvents and efficient inkjet printing with reduced nozzle clogging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high-temperature curing is used to convert polyamic acid to polyimide, then complete curing and film formation are achieved, but substrate and equipment damage occur
Solution Approach 1:
The patent changes the curing temperature parameter from high temperature (conventional method) to low temperature (invention method) by using polyimide polymers with end-cap groups that can undergo cycloreversion reactions at temperatures of 150°C or lower, thereby achieving complete curing without substrate damage
Solution Approach 2:
The patent extracts the end-cap groups containing cycloreversion-capable moieties from the polymer structure, allowing these groups to undergo thermal reactions at low temperatures and initiate crosslinking without requiring high-temperature processing throughout the entire system
2Quantity of substance
If polyamic acid is used as the coating material, then solubility in moderate polarity solvents is improved, but film shrinkage and stress increase during dehydration curing
Solution Approach 1:
The patent inverts the conventional approach by starting with pre-formed polyimide polymers (instead of polyamic acid) and using end-cap groups that undergo cycloreversion to enable low-temperature crosslinking, thereby avoiding the dehydration shrinkage and stress problems associated with polyamic acid curing
Solution Approach 2:
The patent creates a composite structure within the polymer by incorporating end-cap groups with cycloreversion-capable moieties (such as norbornene, oxanorbornene, or cyclooctene groups) into the polyimide backbone, combining the solubility advantages of polyimide with the reactivity needed for low-temperature curing
3Ease of manufacture
If conventional polyimide polymers are used for inkjet printing, then film formation is achieved, but nozzle clogging and poor storage stability occur
Solution Approach 1:
The patent changes the molecular structure parameters of the polyimide polymer by introducing end-cap groups with cycloreversion-capable moieties, which improve solubility in moderate polarity solvents and prevent nozzle clogging during inkjet printing while maintaining storage stability
Solution Approach 2:
The patent applies local quality modification by placing functional end-cap groups at the ends of the polymer chains, where these localized modifications provide solubility and reactivity without affecting the bulk properties of the polyimide structure, thereby enabling inkjet processability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides polyimide polymers with improved solubility and storage stability, minimizing clogging and substrate damage, while enabling low-temperature curing for more efficient and flexible film formation in microelectronic applications.
Implementation Method 1
The end-cap group is capable of undergoing a cycloreversion reaction (e.g., in the solid state at a temperature at most about 250°C)
Data Source
AI summary
This disclosure relates to a polymer that includes a first repeat unit and at least one end-cap group at one end of the polymer. The first repeat unit includes at least one imide moiety and at least one indane-containing moiety. The end-cap group is capable of undergoing a cycloreversion reaction. This disclosure also relates to a thermosetting composition containing the above polymer.