End Effector Flatness Verification via Electrical Continuity
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Solution Overview
Problem
Existing methods for measuring the flatness of end effectors in semiconductor processing tools are costly, time-consuming, and often inaccurate, as they rely on manual visual assessment or expensive equipment like lasers, and can cause deformation during measurement, leading to unreliable results.
Innovation Solution
A method using electrical continuity between a probe and the end effector to determine vertical height measurements, allowing for accurate estimation of flatness by establishing an electrically conductive path at multiple points, minimizing deflection, and using a jig to position the probe at various locations for comprehensive measurement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If manual visual assessment or expensive equipment like lasers is used to measure end effector flatness, then measurement capability is provided, but cost and time consumption increase significantly
Solution Approach 1:
The patent replaces complex mechanical measurement systems (lasers, visual assessment tools) with a simple electrical continuity detection system. A probe makes contact with measuring points on the end effector, and electrical continuity is detected to determine vertical height measurements. This substitution dramatically reduces measurement time and cost while maintaining accuracy.
Solution Approach 2:
The end effector itself provides the measurement signal through its electrical properties. The measuring points on the end effector are electrically conductive, allowing the system to use the end effector's own electrical characteristics for measurement without requiring external complex measurement equipment.
2Measurement precision
If traditional measurement methods are used, then flatness measurement is achieved, but measurement deformation occurs leading to inaccurate results
Solution Approach 1:
The patent uses point contact measurement instead of distributed contact. The probe contacts specific measuring points on the end effector locally, minimizing the total contact area and reducing the likelihood of causing deformation. This localized measurement approach preserves the end effector's original shape during measurement.
Solution Approach 2:
By replacing mechanical pressure-based measurement with electrical continuity detection, the system eliminates the need for significant contact force. The electrical measurement requires minimal probe pressure, preventing mechanical deformation of the end effector during the measurement process.
3Measurement precision
If expensive laser equipment is used for measurement, then measurement capability is provided, but device complexity and cost increase
Solution Approach 1:
The patent replaces complex optical laser measurement systems with simple electrical continuity detection circuitry. The measurement system consists of a probe, electrical connections, and a continuity detector, which are far simpler than laser equipment while providing comparable measurement capability.
Solution Approach 2:
The patent uses inexpensive electrical components (probe, wires, continuity detector) instead of expensive laser equipment. These simple electrical components are much cheaper and easier to maintain, making the measurement system accessible and practical for routine use.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach provides a low-cost, accurate, and repeatable method for measuring end effector flatness, reducing measurement errors and downtime by enabling point contact with minimal deflection, thus ensuring the end effector remains within acceptable flatness parameters to prevent wafer damage.
Implementation Method 1
determining when the probe and the first measuring point have formed electrical continuity
Data Source
AI summary
Methods, kits, systems, and apparatuses, for measuring and/or verifying end effector flatness using electrical continuity are provided.


