Semiconductor End Effector Jig Replacement Without Re-Teaching

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

The existing methods for replacing end effectors in semiconductor processing systems require re-teaching the placement of new end effectors, which prolongs post-commissioning service events and increases downtime due to the need to reinstall and requalify the processing module.

Innovation Solution

The method involves fixing end effector jigs to the load lock module stages, positioning and replacing the end effectors using sensors and jigs to align and fix the new end effectors without re-teaching their placement, thereby eliminating the need for requalification and reducing downtime.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If the traditional re-teaching method is used to replace end effectors, then the placement precision of end effectors is maintained, but the service time and downtime are significantly prolonged

Engineering Contradiction:
Improveplacement precisionVSAvoidservice time
Core Design Contradiction:
Measurement precisionVSLoss of time

Solution Approach 1:

The system performs preliminary teaching of end effector placement parameters during the initial setup phase. These pre-acquired parameters are stored and reused during subsequent end effector replacements, eliminating the need for re-teaching while maintaining placement precision. This preliminary action captures the placement characteristics in advance, allowing rapid replacement without time-consuming re-calibration.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The invention creates a digital copy of the end effector placement parameters during initial teaching. This copied parameter set is then reused during replacement operations, allowing the system to replicate the original placement precision without physically re-teaching the end effector. The parameter copy serves as a reusable template for maintaining accuracy across multiple replacements.

Inventive Principle:
Principle #26Copying

2Measurement precision

If the traditional re-teaching process is performed, then the placement accuracy is ensured, but the complexity of the replacement procedure increases

Engineering Contradiction:
Improveplacement accuracyVSAvoidreplacement procedure complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The system performs the complex teaching and measurement procedures in advance during initial setup. By completing these complex operations beforehand and storing the results as reusable parameters, the actual replacement process becomes simple and straightforward, requiring only parameter retrieval and application without repeating the complex measurement and teaching steps.

Inventive Principle:
Principle #10Preliminary action

3Measurement precision

If transparent covers are installed for re-teaching, then the placement error can be measured, but the production configuration is disrupted and requalification is required

Engineering Contradiction:
Improveplacement error measurementVSAvoidproduction availability
Core Design Contradiction:
Measurement precisionVSProductivity

Solution Approach 1:

The system performs placement error measurement and teaching during the initial setup phase before production begins. By completing all necessary measurements and parameter acquisitions in advance, the production system remains undisturbed during replacements, maintaining continuous availability without requiring installation of transparent covers or requalification procedures.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The invention creates a digital replica of the placement parameters during initial teaching with transparent covers. This copied parameter set allows subsequent replacements to proceed without physically installing transparent covers, thereby maintaining production configuration and avoiding disruptions to productivity while still ensuring placement accuracy through the use of the copied parameters.

Inventive Principle:
Principle #26Copying

Data Source

PatentUS12119256B2Replacing end effectors in semiconductor processing systems
Publication Date: 2024.10.15 ASM IP HLDG BV
  • US12119256B2 patent drawing
  • US12119256B2 patent drawing
  • US12119256B2 patent drawing

AI summary

A method of replacing an end effector for wafer handling in a semiconductor processing system includes fixing a first end effector jig to a first stage and a second end effector jig to a second stage of the load lock module; positioning a first end effector at the first end effector jig and a second end effector at the second end effector jig, the second end effector fixed relative to the first end effector; and fixing the second end effector to the second end effector jig. The first end effector is replaced with a replacement end effector and the semiconductor processing system returned to production without re-teaching placement of the replacement end effector in a processing module connected to a wafer handling module mounting the end effectors. Semiconductor processing systems and end effector jigs for replacing end effectors in semiconductor processing systems are also described.