Endoscope Image Pickup Unit With Airtight Tube-Sealed Circuit Boards
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Solution Overview
Problem
Endoscopes with electronic components at the distal end portion face issues with humidity and air exposure, leading to reliability degradation and complex manufacturing due to the need for small-diameter cable placement.
Innovation Solution
An image pickup unit with a ceramic circuit board and metal rectangular tube that seals an electronic component in a recess, providing an airtight seal to protect against humidity and simplify manufacturing by integrating movement detection sensors with image sensors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If electronic components are disposed at the distal end portion of the insertion portion to add new functions, then the endoscope performance is improved, but the reliability deteriorates due to humidity and air exposure
Solution Approach 1:
The electronic component is nested within a recess formed in the circuit board, creating a protective cavity that shields the component from external environmental factors such as humidity and air exposure, thereby maintaining reliability while enabling advanced functionality
Solution Approach 2:
A sealing structure comprising a sealing member and a cap is introduced to create an airtight environment around the electronic component in the recess, protecting it from humidity and air exposure while allowing the component to maintain its enhanced performance
2Adaptability or versatility
If electronic components are disposed at the distal end portion to add new functions, then the endoscope performance is improved, but the manufacturing complexity increases due to small-diameter cable placement requirements
Solution Approach 1:
The electronic component is directly mounted and sealed within the circuit board structure itself, merging the component housing and circuit board into a single integrated unit, which eliminates the need for separate small-diameter cable placement procedures and simplifies manufacturing
3Ease of manufacture
If electronic components are exposed to humidity and air, then manufacturing is simplified, but reliability degradation occurs
Solution Approach 1:
The electronic component is pre-positioned in the recess and sealed with the sealing member and cap during the circuit board assembly process, creating a protected environment before the component is exposed to external conditions, thereby ensuring reliability without complicating manufacturing
Data Source
AI summary
An electronic device for use with an endoscope, the electronic device including: a first circuit board including a first side surface; a first solder disposed on the first side surface; a second circuit board including a second side surface; a second solder disposed on the second side surface; an electronic component provided between the first and the second circuit boards; and a tube bonded to each of the first and the second side surfaces by the first and the second solders to seal the electronic component in an airtight manner.


