Endoscope Heat Dissipation via Multi-Core Cable
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Solution Overview
Problem
Existing endoscopes face challenges in reducing the size and weight of heat dissipation mechanisms while maintaining effective heat dissipation, leading to increased material costs and physical stress on patients due to large-sized heat dissipation members.
Innovation Solution
A lightweight heat dissipation mechanism is implemented using a heat dissipation substrate attached parallel to the image sensor, connected to a multi-core cable with an electrically conductive layer, allowing heat to be dissipated through the substrate and cable, reducing the need for large-sized components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a large-sized heat dissipation member is provided to the image sensor, then heat dissipation performance is improved, but the insert section becomes large in diameter and heavy
Solution Approach 1:
The patent combines multiple functions into the multi-core cable: signal transmission and heat dissipation. The cable includes both signal lines for transmitting image signals and a heat dissipation function through the conductive layer and outer sheath, eliminating the need for separate large-sized heat dissipation members.
Solution Approach 2:
The multi-core cable serves dual purposes: transmitting electrical signals from the image sensor and dissipating heat generated by the image sensor. The conductive layer and outer sheath of the cable are utilized for heat dissipation, making the cable a multi-functional component that reduces overall system weight and size.
2Temperature
If a large-sized heat dissipation member is provided to the image sensor, then heat dissipation performance is improved, but material cost increases
Solution Approach 1:
The patent merges the heat dissipation function with the existing multi-core cable structure, utilizing the conductive layer and outer sheath that are already part of the cable assembly. This approach avoids the need for additional expensive heat dissipation materials and components.
Solution Approach 2:
The multi-core cable is designed to perform both signal transmission and heat dissipation functions, maximizing the utility of existing cable components. The conductive layer and outer sheath, which are standard parts of a multi-core cable, are repurposed for heat dissipation, reducing material costs compared to adding dedicated heat dissipation members.
3Temperature
If a large-sized heat dissipation member is provided to the image sensor, then heat dissipation performance is improved, but the insert section becomes large in diameter
Solution Approach 1:
The patent integrates the heat dissipation function into the multi-core cable structure, utilizing the existing cable diameter and structure. The conductive layer and outer sheath of the cable serve as heat dissipation pathways, eliminating the need for additional external heat dissipation components that would increase the insert section diameter.
Solution Approach 2:
The multi-core cable is designed to simultaneously transmit signals and dissipate heat, making efficient use of the cable's existing structure. The heat dissipation function is achieved through the conductive layer and outer sheath that are already part of the cable assembly, avoiding any increase in the insert section diameter.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution results in a downsized, lightweight, and cost-effective heat dissipation mechanism that effectively manages heat from the image sensor, improving image quality by preventing temperature-related instability.
Implementation Method 1
The heat dissipation substrate transmits heat from the image sensor
Implementation Method 2
The connection member transmits the heat, from the image sensor, from the heat dissipation substrate to the electrically conductive layer
Data Source
Figure 1
Figure 2~3
Figure 4
AI summary
An endoscope (10) comprises an image sensor (54) incorporated in a distal portion (14A) of an insert section (14) to be inserted in a body cavity, a heat dissipation substrate (57, 75), a multi-core cable (34), and a connection member (72). The heat dissipation substrate is attached to the back of a circuit board (55) that supports the image sensor. The multi-core cable has signal lines (34A) and a second shield member (34C). The signal lines, each covered with a first shield member (34B), transmit signals to/from the image sensor. The second shield member covers and holds the signal lines together. The second shield member has an electrically conductive layer (34C2). The connection member transmits heat, generated in the image sensor, from the heat dissipation substrate to the second shield member.