Endoscope Conductive Glue and Laser Welding for Miniaturized Rigidity
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Solution Overview
Problem
Traditional endoscope devices face challenges in maintaining rigidity when miniaturized, leading to structural damage and inaccurate connections of small conductive wires, which affects their operational reliability.
Innovation Solution
The design incorporates an image capturing unit with conductive pads, a supporting unit with carrying portions, and coaxial conductive units connected via conductive glue and laser welding, ensuring electrical connections without short-circuits and enhancing manufacturing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the endoscope device is miniaturized to reduce size, then it can be inserted into human body for internal inspection, but the structural rigidity deteriorates leading to cracking and connection failures
Solution Approach 1:
The device is divided into modular components (lens unit, image capturing unit, signal processing unit, display unit) that can be independently optimized and assembled, allowing each segment to maintain appropriate size and strength characteristics while contributing to the overall miniaturized device
Solution Approach 2:
The patent employs composite construction with tube-case, lens holder, and supporting structures that combine different materials to achieve both miniaturization and structural rigidity, preventing cracking while maintaining small form factor
2Volume of moving object
If the conductive wires are shrunk to enable miniaturization, then the device size is reduced, but the welding precision requirement increases and connection reliability deteriorates
Solution Approach 1:
A circuit board is introduced as an intermediary component that provides standardized connection interfaces, eliminating the need for direct welding between shrunk conductive wires and other components, thereby reducing welding precision requirements while maintaining electrical connectivity
Solution Approach 2:
The circuit board serves multiple functions including signal transmission, mechanical support, and connection interface standardization, allowing various conductive wires of different sizes to connect reliably through unified mounting holes and soldering pads
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration maintains the structural integrity and electrical performance of the endoscope device, preventing undesired cracking and ensuring reliable signal transmission even at micro-sizes.
Implementation Method 1
a first coaxial conductive unit electrically connected with and corresponding to one of the at least two conductive pads
Implementation Method 2
laser welding, ensuring electrical connections without short-circuits
Data Source
AI summary
An endoscope device comprises an image capturing unit, a supporting unit, a first and a second coaxial conductive units, and a conductive glue. The image capturing unit has a sensing surface and a back surface with at least two conductive pads thereon. The supporting unit has at least two carrying portions corresponding to the at least two conductive pads respectively. The supporting unit is connected with the back surface of the image capturing unit and extends along a direction approximately orthogonal to the back surface. The first and second coaxial conductive units are located at corresponding carrying portions respectively. The conductive glue covers the first coaxial conductive unit and the conductive pad corresponding to the first coaxial conductive unit, and covers the second coaxial conductive unit and the conductive pad corresponding to the second coaxial conductive unit.