Endoscope Connector Shielding Structure for EMC and Simpler Assembly
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Solution Overview
Problem
Conventional endoscope connectors face challenges in meeting EMC conformity by effectively suppressing electromagnetic interference while maintaining assembly simplicity and reducing noise emission, as they require complex metal shielding configurations that increase parts count and assembly complexity.
Innovation Solution
The endoscope connector incorporates a metal electromagnetic shield member that abuts onto a metal frame, utilizing an urging member to establish an electric conduction state, thereby enhancing noise immunity and reducing the need for additional shielding components, while simplifying assembly through a board-to-board connector configuration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-generated harmful factors
If a substrate shield made of metal covering a main-substrate and a signal wire connected to the main-substrate are connected to a metal frame having a large current-carrying capacity, then noise emission is suppressed, but the device complexity and parts count increase
Solution Approach 1:
The patent combines the substrate shield and connector shield into a single integrated electromagnetic shield member made of metal. This shield member simultaneously covers both the main-substrate and signal wires, eliminating the need for separate substrate shield and connector shield components. The integrated shield is connected to the metal frame through multiple electric connection members, achieving noise suppression while reducing device complexity and parts count.
Solution Approach 2:
The electromagnetic shield member serves multiple functions: it acts as both a substrate shield covering the main-substrate and a connector shield covering the signal wires. Additionally, it provides both electromagnetic shielding and structural support when connected to the metal frame. This multi-functionality reduces the number of components needed while maintaining effective noise suppression.
2Object-affected harmful factors
If a connector shield made of metal covering a periphery of a signal wire connected to a substrate unit and the main-substrate is interposed, then noise immunity is increased, but the device complexity and parts count increase
Solution Approach 1:
The patent integrates the substrate shield and connector shield functions into a single electromagnetic shield member. This unified shield structure covers both the main-substrate and signal wires simultaneously, providing comprehensive noise immunity without requiring separate substrate shield and connector shield components, thereby reducing device complexity.
Solution Approach 2:
The electromagnetic shield member is made of metal material that provides effective electromagnetic shielding. By using metal for the integrated shield, the patent achieves high noise immunity while maintaining structural integrity and electrical conductivity, eliminating the need for multiple separate shielding components.
3Object-generated harmful factors
If multiple separate shielding components are used to meet EMC conformity, then electromagnetic interference is suppressed, but the number of noise suppression components increases
Solution Approach 1:
The patent consolidates multiple separate shielding components (substrate shield, connector shield) into a single integrated electromagnetic shield member. This unified shield structure provides comprehensive electromagnetic interference suppression for both the main-substrate and signal wires, significantly reducing the number of noise suppression components while maintaining EMC conformity.
Solution Approach 2:
The electromagnetic shield member is designed to perform multiple shielding functions simultaneously - covering the main-substrate, protecting signal wires, and providing structural support. This multi-functionality allows a single component to replace what would traditionally require multiple separate noise suppression components.
4Object-generated harmful factors
If a complex metal shielding configuration is used to meet EMC conformity, then electromagnetic interference is suppressed, but assembly complexity increases
Solution Approach 1:
The patent integrates multiple shielding functions into a single electromagnetic shield member that can be installed as one component. This unified shield structure eliminates the need for assembling multiple separate shields, significantly simplifying the assembly process while maintaining effective electromagnetic interference suppression and meeting EMC conformity requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses electromagnetic interference, meets EMC conformity requirements, and reduces the number of noise suppression components, leading to improved noise immunity and simplified assembly processes.
Implementation Method 1
an electromagnetic shield member covering the second substrate... effectively suppresses electromagnetic interference, meets EMC conformity requirements
Implementation Method 2
an urging member configured to urge the substrate unit in a direction of causing the substrate unit to be close to the second frame, and to put the electromagnetic shield member into an electric conduction state by causing the electromagnetic shield member to abut on the second frame
Implementation Method 3
a second frame electrically connected to the first frame, the second frame being made of metal... put the electromagnetic shield member into an electric conduction state
Data Source
AI summary
An endoscope connector includes: a plug including an electric contact configured to be electrically connected to an external medical apparatus, the plug being provided with a first substrate; a first frame electrically connected to the plug; a second frame electrically connected to the first frame, the second frame being made of metal; a first electric connection member electrically connected to the first substrate; a second electric connection member connected to the first electric connection member; a substrate unit including a second substrate and an electromagnetic shield member covering the second substrate, the electromagnetic shield member being made of metal; and an urging member configured to urge the substrate unit in a direction of the second frame, and to put the electromagnetic shield member into an electric conduction state by causing the electromagnetic shield member to abut on the second frame.