Endoscope Cooling Unit with Segmented Flow Paths
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Solution Overview
Problem
Existing cooling units for endoscope light source apparatuses face challenges in efficiently dissipating heat from multiple solid-state light emitting devices, particularly due to varying thermal resistance values among different LEDs, which can lead to thermal interference and reduced cooling efficiency.
Innovation Solution
A cooling unit is designed with separate flow paths for different cooling media, where heat dissipation sections with varying thermal resistance values are strategically placed to minimize thermal interference and enhance cooling efficiency, utilizing a configuration that includes a first and second flow path with distinct heat dissipation sections for specific LEDs, optimizing heat transfer based on their thermal performance indices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If multiple heat dissipation sections are provided for multiple solid-state light emitting devices, then heat dissipation capability is improved, but thermal interference between adjacent heat dissipation sections occurs and cooling efficiency deteriorates
Solution Approach 1:
The cooling unit is divided into multiple independent flow paths (first flow path, second flow path, third flow path) that are spatially separated. Each flow path contains specific heat dissipation sections (first, second, third heat dissipation sections) that are thermally connected to corresponding solid-state light emitting devices. This segmentation prevents thermal interference between adjacent heat dissipation sections while maintaining effective heat dissipation for each device.
2Volume of moving object
If heat dissipation sections are arranged in a compact configuration, then device size is reduced, but thermal interference increases and cooling efficiency decreases
Solution Approach 1:
The patent utilizes three-dimensional spatial arrangement by providing heat dissipation sections at different heights (first height, second height, third height) and arranging flow paths in multiple dimensions. The first flow path is arranged above the second flow path, and the third flow path is arranged below the second flow path. This dimensional arrangement allows compact device size while preventing thermal interference through spatial separation.
3Ease of manufacture
If uniform cooling is applied to all solid-state light emitting devices, then manufacturing is simplified, but devices with different thermal resistance values experience suboptimal cooling performance
Solution Approach 1:
The patent implements differentiated cooling strategies for different solid-state light emitting devices based on their thermal characteristics. The first solid-state light emitting device is cooled by the first flow path, the second device by the second flow path, and the third device by the third flow path. Each flow path can be independently configured with appropriate cooling media and flow rates, allowing optimization for each device's specific thermal resistance value while maintaining a relatively simple overall manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves cooling efficiency by preventing thermal interference and allows for a downsized light source apparatus, effectively managing heat dissipation across multiple LEDs with different thermal characteristics.
Implementation Method 1
a first heat dissipation section that is thermally connected to the first heat generation section, and is disposed in the first flow path to dissipate heat to the first cooling medium passing through the first flow path
Implementation Method 2
dissipate heat generated from a plurality of heat generation sections to cooling media by a plurality of heat dissipation sections
Data Source
AI summary
The cooling unit includes: an opening part through which the cooling media flow in; a first flow path; a second flow path; a first heat generation section; a second heat generation section; a first heat dissipation section that is thermally connected to the first heat generation section, and is disposed in the first flow path; and a second heat dissipation section that is thermally connected to the second heat generation section, and is disposed in the second flow path. The second flow path is disposed between the first and second heat generation sections and the first flow path, and the first heat dissipation section has a thermal resistance value smaller than a thermal resistance value of the second heat dissipation section.