Endoscope Distal End Unit Wafer Level Optics Integration
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Solution Overview
Problem
Conventional endoscopes face challenges in reducing the diameter of the distal end portion while maintaining optical performance and ensuring biological compatibility, particularly in integrating functional components like image pickup units within a rigid distal end frame.
Innovation Solution
The distal end unit incorporates an image pickup unit made using wafer level optics, integrated within a resin molded distal end frame with a columnar shape, featuring a lens stack body and an image pickup device, and filled with a light-blocking filler to cover the outer circumference, reducing the diameter and protecting the optical components without the need for additional shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional image pickup units and optical components are integrated in a rigid distal end frame, then functional components can be securely mounted, but the diameter of the distal end portion increases
Solution Approach 1:
The patent merges the image pickup unit, optical unit, and distal end frame into a single integrated structure using wafer level optics technology. The optical unit is formed integrally with the image pickup device on the same substrate, eliminating the need for separate mounting components and reducing overall diameter while maintaining functional integration.
Solution Approach 2:
The patent employs nested integration where the optical unit is embedded within the image pickup unit structure, which itself is integrated into the distal end frame. This nested arrangement allows functional components to be packed efficiently in a compact configuration, reducing the distal end diameter while maintaining all necessary functions.
2Reliability
If additional shielding structures are added to protect optical components from light, then optical performance is maintained, but device complexity and diameter increase
Solution Approach 1:
The patent extracts the light-blocking function from separate shielding structures and integrates it directly into the distal end frame material. The frame itself is made of light-blocking material, eliminating the need for additional shielding components while maintaining optical performance and reducing device complexity.
Solution Approach 2:
The distal end frame serves multiple functions simultaneously: it provides structural support, blocks light to protect optical components, and integrates the image pickup unit. This multi-functional design eliminates the need for separate shielding structures while maintaining optical performance.
3Volume of moving object
If wafer level optics technique is used to integrate optical unit and image pickup device, then device diameter is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The patent replaces traditional mechanical assembly methods with wafer level optics fabrication techniques. Optical components are formed using semiconductor manufacturing processes such as photolithography and etching, which provide superior precision control compared to mechanical assembly, enabling compact integration while maintaining manufacturing feasibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for a reduction in the distal end portion's diameter while maintaining optical performance and ensuring biological compatibility, with the filler providing light blocking and structural integrity, and facilitating easy electrical connections through molded interconnect device techniques.
Implementation Method 1
an optical unit and an image pickup device that are integrally formed, the optical unit being constituted by a lens stack body
Implementation Method 2
a filler having light blocking property, the image pickup unit containing room being filled with the filler so that the filler covers an outer circumference of the image pickup unit
Data Source
AI summary
A distal end unit includes: an image pickup unit made using a wafer level optics technique; a distal end frame forming an external shape of an insertion portion, the distal end frame being constituted by a resin molded article; an image pickup unit containing room containing the image pickup unit in an interior of the distal end frame, the image pickup unit containing room including a first opening portion and a second opening portion that are continuously formed, the first opening portion being positioned on the distal end surface of the distal end frame, the second opening portion being positioned on a side surface of the distal end frame; and a filler having light blocking property, the image pickup unit containing room being filled with the filler, the filler forming the external shape of a distal end portion with the distal end frame.