Endoscope Frame Body Segmentation for Thermal Stress Relief

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Endoscope apparatuses face issues with the detachment of solid-state image pickup devices due to stress caused by high temperature and pressure during autoclave sterilization, leading to defective images, as existing adhesives expand and impose stress on the bonding between the glass cover and the image pickup device.

Innovation Solution

The endoscope apparatus incorporates a frame body with a fixing region and a non-fixing region, where the glass cover and image pickup device are not directly fixed by the adhesive, allowing for expansion without transmitting stress, and tension in the image pickup cable is managed to reduce detachment risk.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If adhesive is used to fix the glass cover and image pickup device together, then the bonding strength is improved, but stress concentration occurs during high temperature autoclave sterilization causing detachment

Engineering Contradiction:
Improvebonding strengthVSAvoidresistance to thermal stress
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The frame body is divided into a fixing region (where adhesive is applied to secure the image pickup device to the frame) and a non-fixing region (where the glass cover and image pickup device are not directly bonded). This segmentation allows the adhesive to provide structural support while avoiding stress concentration at the glass cover bonding interface during thermal expansion.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The adhesive application is localized to specific regions: it is applied between the image pickup device and frame body in the fixing region, but deliberately avoided in the non-fixing region where the glass cover interfaces with the image pickup device. This creates different bonding characteristics in different locations to accommodate thermal stress differently.

Inventive Principle:
Principle #3Local quality

2Ease of manufacture

If the glass cover and image pickup device are directly bonded, then assembly simplicity is improved, but impact resistance and stress distribution are worsened

Engineering Contradiction:
Improveassembly simplicityVSAvoidimpact resistance
Core Design Contradiction:
Ease of manufactureVSStrength

Solution Approach 1:

The bonding structure is segmented into two functional zones: a fixing region for structural attachment and a non-fixing region for stress relief. This allows the assembly to maintain simplicity while improving impact resistance through strategic placement of adhesive bonds.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The frame body acts as an intermediary structure between the image pickup device and the glass cover. The fixing region bonds the image pickup device to the frame, while the non-fixing region allows the glass cover to remain relatively independent, with the frame mediating the mechanical connection and stress distribution.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances the durability of the image pickup unit by preventing stress-induced detachment and maintaining image quality under high temperature conditions, while also improving assemblability and impact resistance.

Implementation Method 1

Respective members and charged adhesives in each endoscope expand under high temperature. At the time of the expansion, stress may be imposed on the part of the bonding between the glass cover and the solid-state image pickup device

Methodology Applied
Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS10757303B2Endoscope apparatus
Publication Date: 2020.08.25 EVIDENT CORP
  • US10757303B2 patent drawing
  • US10757303B2 patent drawing
  • US10757303B2 patent drawing

AI summary

An endoscope apparatus includes: an image pickup device; a glass lid that is provided on a distal end side ahead of a light receiving surface of the image pickup device and is fixed to a front face of the image pickup device in an integrated manner; and a frame body that covers at least a part of the image pickup device and the glass lid. The frame body includes a fixing region for fixing an image pickup circuit portion provided on a proximal end side opposite to the front face of the image pickup device, and a non-fixing region that keeps the distal end side relative to the light receiving surface of the image pickup device and the glass lid fixed to the light receiving surface of the image pickup device in a non-fixed state.