Endoscope Holding Frame with 3D Molded Interconnect Device
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Solution Overview
Problem
Existing endoscope designs face challenges in efficiently manufacturing a holding frame that can securely house and connect the imaging unit at the distal end, particularly in reducing the diameter of the endoscope while maintaining structural integrity and ease of manufacturing.
Innovation Solution
A cylindrical three-dimensional molded interconnect device (MID) with a housing, connection terminal, cable connection electrode, and wiring pattern is used, featuring notches and cut faces for resin molding and electrical connectivity, allowing for complex structures to be manufactured inexpensively and with reduced diameter.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a metal holding frame is used, then structural integrity is maintained, but manufacturing complexity and cost increase
Solution Approach 1:
The holding frame material is changed from metal to resin, fundamentally altering the material parameter. This enables the use of injection molding technology, which significantly simplifies manufacturing while maintaining sufficient structural integrity for the application
Solution Approach 2:
The holding frame is constructed as a composite structure combining resin material with integrated metal connection terminals and wiring patterns. This allows the bulk structure to be made of easy-to-manufacture resin while critical electrical connection points use metal components
2Length of moving object
If the distal end diameter is reduced, then endoscope flexibility and patient comfort improve, but structural integrity and manufacturing difficulty worsen
Solution Approach 1:
The connection terminals and wiring patterns are nested directly within the holding frame structure during injection molding. This integration eliminates the need for separate components and assembly steps, enabling reduced diameter without compromising structural integrity
Solution Approach 2:
The wiring pattern is formed on the inner surface of the holding frame in three-dimensional space during molding. This spatial arrangement allows electrical connections to be established without adding external diameter, as the wiring utilizes the internal volume of the frame structure
3Ease of manufacture
If resin molding is used, then manufacturing cost and complexity are reduced, but electrical connectivity and structural precision worsen
Solution Approach 1:
The connection terminals and wiring patterns are formed as integral parts of the holding frame during the injection molding process itself, before final assembly. This preliminary formation ensures precise electrical connection points are created with the required accuracy without requiring subsequent precision machining or assembly operations
Solution Approach 2:
Metal connection terminals are embedded within the resin holding frame during molding, serving as an intermediary between the resin structure and electrical connection requirements. This allows the resin to provide structural function while the metal terminals ensure precise electrical connectivity
Data Source
AI summary
A holding frame for an imaging unit arranged at a distal end of an endoscope includes a cylindrical three-dimensional molded interconnect device; a housing configured to house the imaging unit, the housing being formed of a notch; at least one cut face formed on the side face of the holding frame and obtained by cutting a support portion which is a gate portion into which a resin is injected when the holding frame is resin-molded; a connection terminal formed on a bottom face of the housing portion and configured to be connected to the imaging unit; a cable connection electrode arranged on a face where a proximal end side of the holding frame is notched; and a wiring pattern formed on a surface area of the holding frame excluding the cut face and configured to electrically connect the connection terminal and the cable connection electrode.