Resin-Sealed Endoscope Image Pickup Module Bonding Junction

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing endoscopes with image pickup apparatuses face challenges in miniaturization and invasiveness due to the size and complexity of the bonding junction between the imager and signal cable, which affects the rigidity and manufacturability of the distal end portion.

Innovation Solution

The implementation of a resin-sealed bonding junction between the imager's external electrode and the signal cable's distal end, where the resin is accommodated in a space defined by a ring-shaped groove on the signal cable, allowing for a compact and miniaturized design by controlling the resin's curing and spread using interfacial tension and UV or thermosetting treatments.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the bonding junction between imager and signal cable is sealed with adhesive resin, then the bonding junction is protected and sealed, but the overall size of the image pickup apparatus increases

Engineering Contradiction:
Improvesealing of bonding junctionVSAvoidsize of image pickup apparatus
Core Design Contradiction:
ReliabilityVSVolume of moving object

Solution Approach 1:

The resin is nested within the space formed by extending the rear face of the imager in the optical axis direction. The ring-shaped groove on the signal cable contains the resin, creating a nested structure where the sealing resin is housed within the existing structural space rather than adding external volume.

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The patent utilizes the space formed when the rear face is extended in the optical axis direction (depth dimension) rather than expanding the bonding junction area in the radial direction. This dimensional approach allows sealing without increasing the outer diameter of the image pickup apparatus.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If the distal end portion of the signal cable is bonded to the external electrode of the imager, then electrical connection is established, but the bonding junction becomes complex and difficult to manufacture

Engineering Contradiction:
Improveelectrical connectionVSAvoidmanufacturability of bonding junction
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

Adhesive resin serves as an intermediary material between the distal end portion of the signal cable and the external electrode of the imager. This mediator enables reliable electrical connection through bonding while simplifying the manufacturing process by providing a straightforward adhesive bonding method rather than complex mechanical or soldering techniques.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Volume of moving object

If the image pickup apparatus is miniaturized, then invasiveness is reduced, but the bonding junction between imager and signal cable becomes more difficult to seal properly

Engineering Contradiction:
Improvesize of image pickup apparatusVSAvoidsealing of bonding junction
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

The ring-shaped groove is formed locally on the signal cable at a specific position to contain the resin. This localized structural feature ensures proper sealing of the bonding junction while maintaining the overall miniaturized design, as the sealing function is concentrated in a specific local area rather than requiring extensive sealing structures throughout the apparatus.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach results in a shorter, smaller, and more minimally invasive endoscope with improved manufacturability, as the resin-sealed junction maintains the compactness of the image pickup module without increasing the outer diameter, facilitating easier production and reduced invasiveness.

Implementation Method 1

the resin is curing-treated

Methodology Applied
Scientific EffectUV curing: Photopolymerisation

Implementation Method 2

UV or thermosetting treatments

Methodology Applied
Scientific EffectThermosetting:

Data Source

PatentUS10924640B2Image pickup module and endoscope including image pickup module in which bonding junction between image pickup portion and signal cable is resin-sealed by curable resin
Publication Date: 2021.02.16 OLYMPUS CORPORATION(JP)
  • US10924640B2 patent drawing
  • US10924640B2 patent drawing
  • US10924640B2 patent drawing

AI summary

An endoscope includes an image pickup apparatus disposed in a rigid distal end portion. The image pickup apparatus is provided with: an image pickup sensor with an external electrode being disposed on a rear face; a signal cable, a distal end portion of which is bonded to the external electrode of the imager; and resin sealing a bonding junction between the external electrode and the distal end portion, where the resin is accommodated in a space formed when the rear face is projected in a direction of an optical axis of the imager. A rear end position of the resin is defined by a resin stopping portion of the signal cable.