Asymmetric Component Placement for Resin Injection in Endoscope Image Pickup Units
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Solution Overview
Problem
Existing image pickup units for endoscopes face challenges in efficiently filling the spaces between small electronic components with resin, leading to potential voids, reliability issues, and increased manufacturing time.
Innovation Solution
The image pickup unit design includes a circuit board with a depression that accommodates electronic components, where the first electronic component is positioned closer to one side surface with a greater distance to the wall surface than other components, allowing for efficient resin injection and distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If electronic components are densely arranged in the depression to save space, then the volume of the image pickup unit is reduced, but the resin filling becomes difficult and voids may occur
Solution Approach 1:
The patent applies local quality by creating a localized resin injection path through asymmetric component arrangement. The first electronic component is positioned to provide a specific distance from the first wall surface, creating a controlled local space for resin injection. This localized approach ensures reliable resin filling in the critical injection path area while allowing dense packing elsewhere in the depression, thus resolving the contradiction between compact volume and reliable resin filling quality.
2Reliability
If the depression is made larger to accommodate more resin, then the resin filling reliability is improved, but the area occupied on the circuit board increases
Solution Approach 1:
The patent applies preliminary action by pre-positioning the first electronic component at a specific distance from the first wall surface before resin injection. This preliminary arrangement creates an optimized injection path that maximizes resin filling efficiency within the available depression area. The component placement is designed in advance to ensure adequate resin flow paths without requiring an excessively large depression, thus resolving the contradiction between resin filling reliability and area occupation.
3Productivity
If the first electronic component is positioned closer to the first wall surface to maximize space utilization, then the productivity is improved, but the resin injection becomes difficult and voids may form
Solution Approach 1:
The patent applies asymmetry by intentionally creating an asymmetric distance relationship between the first electronic component and the wall surfaces. The first distance from the first electronic component to the first wall surface is specifically designed to be greater than the second distance to the second wall surface. This asymmetric arrangement optimizes the resin injection path from the first wall surface side, ensuring adequate space for resin flow and void-free filling, while still maintaining high space utilization and manufacturing efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design ensures reliable filling of resin between the electronic components, reducing the risk of voids and enhancing the overall reliability and manufacturing efficiency of the image pickup unit.
Implementation Method 1
injecting resin between the first electronic component and the first wall surface
Implementation Method 2
curing the resin
Data Source
AI summary
An image pickup unit includes a circuit board including a first surface, a first side surface and a second side surface both intersecting the first surface, a depression including a first wall surface and a second wall surface, the depression dividing the first surface into a plurality of surfaces, a plurality of electronic components accommodated in the depression, and a first resin disposed in the depression, wherein the plurality of electronic components comprises a first electronic component disposed closest to the first side surface, a first distance between the first electronic component and the first wall surface, and the first distance is greater than a second distance between each of the plurality of electronic components other than the first electronic component and whichever wall surface is closer between the respective first wall surface and the second wall surface.


