Endoscope Image Pickup Unit Underfill Cutout Design
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Solution Overview
Problem
Existing image pickup units in endoscopes face challenges in efficiently filling underfill agents in the gaps between the image sensor, circuit substrates, and other components, which can lead to mechanical and electrical connectivity issues.
Innovation Solution
The image pickup unit incorporates a cutout on the side surface of the first substrate that penetrates from the distal end surface to the proximal end surface, with specific dimensions and shapes of openings at each end to facilitate the flow of underfill agents through capillary action, ensuring effective filling of gaps between the image pickup device and the substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a cutout portion is formed in the circuit substrate to apply underfill agent, then the underfill agent can be injected into the gap between image pickup device and circuit substrate, but the mechanical strength and structural integrity of the circuit substrate may be compromised
Solution Approach 1:
The cutout portion is segmented into a through-hole structure that penetrates the circuit substrate, allowing the underfill agent to be applied through the hole without requiring large openings that would compromise substrate integrity. The segmentation enables precise delivery of underfill agent to the gap between image pickup device and circuit substrate while maintaining overall substrate strength.
2Ease of operation
If the cutout opening size is increased to facilitate underfill agent flow, then the underfill agent can be easily applied, but the mechanical strength of the circuit substrate is reduced
Solution Approach 1:
The cutout portion is designed with non-uniform opening sizes at different locations - the first opening at the distal end has a different size than the second opening at the proximal end. This local quality variation allows the underfill agent to flow easily through the cutout while the smaller opening at one end maintains the mechanical strength of the circuit substrate. The tapered configuration optimizes both fluid flow and structural integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for efficient and controlled application of underfill agents, enhancing the mechanical and electrical connections between components, thereby improving the reliability and performance of the image pickup unit.
Implementation Method 1
a resin filled in the cutout, a gap between the image pickup device and the first substrate, and a gap between the first substrate and the second substrate
Data Source
AI summary
In an image pickup unit, an image pickup device, a first substrate, and a second substrate are connected in the order from a distal end. The image pickup unit includes a cutout that is provided in a side surface of the first substrate, penetrates from a distal end surface to a proximal end surface, and has a smaller width dimension of an opening on the proximal end surface side than that of an opening of the distal end surface side, and a resin filled in the cutout, a gap between the image pickup device and the first substrate, and a gap between the first substrate and the second substrate.