Endoscope Image Pickup Unit With Airtight Recess Sealing

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Solution Overview

Problem

Endoscopes with electronic components at the distal end portion face issues with humidity and external air affecting component reliability, and the manufacturing of such endoscopes is complicated due to the need for small-diameter cables.

Innovation Solution

An image pickup unit with a ceramic circuit board and a metal rectangular tube that seals an electronic component in a recess in an airtight manner, integrating a movement detection sensor with the image sensor, using soldering to bond the components and ensuring airtightness and thermal conductivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If electronic components are disposed at the distal end portion of the insertion portion, then new functions are added and performance is increased, but humidity and external air affect component reliability

Engineering Contradiction:

ImprovefunctionalityVSAvoidcomponent reliability

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The electronic component is extracted from the general environment and placed inside a sealed recess formed in the circuit board. The recess is sealed with a sealing member to isolate the electronic component from humidity and external air, thereby maintaining reliability while preserving the added functionality.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The circuit board structure is modified locally by forming a recess at the specific location where the electronic component needs to be mounted. This localized structural change provides protection only where needed, allowing the electronic component to be shielded from environmental factors while the rest of the endoscope structure remains unchanged.

Inventive Principle:

Principle #3Local quality

2Productivity

If electronic components are disposed at the distal end portion, then performance is increased, but manufacturing becomes complicated due to the need for small-diameter cables

Engineering Contradiction:

ImproveperformanceVSAvoidmanufacturing complexity

Core Design Contradiction:

ProductivityVSEase of manufacture

Solution Approach 1:

The electronic component is integrated directly into the circuit board structure by mounting it on the sealed recess. This merging of the electronic component with the circuit board eliminates the need for separate cable connections, simplifying manufacturing while maintaining the enhanced performance.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The circuit board serves multiple functions: it provides electrical connections, structural support, and environmental protection through the sealed recess. This multi-functionality reduces the need for additional components and cables, thereby simplifying manufacturing processes.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Reliability

If a recess is formed in the circuit board to house the electronic component, then component protection is achieved, but the structural complexity increases

Engineering Contradiction:

Improvecomponent protectionVSAvoidstructural complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The circuit board is segmented by forming a recess that creates a distinct enclosed space within the board structure. This segmentation allows the electronic component to be housed in a protected compartment while maintaining the overall integrity and simplicity of the circuit board design.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enhances the reliability of the endoscope by reducing the impact of humidity on the electronic components, maintains a small diameter, and simplifies manufacturing by integrating the sensor with the image sensor, while providing electromagnetic shielding and heat release.

Implementation Method 1

a rectangular tube bonded to the first land and the second land and sealing the recess in an airtight manner

Methodology Applied

Scientific EffectAirtight sealing:

Implementation Method 2

using soldering to bond the components and ensuring airtightness and thermal conductivity

Methodology Applied

Scientific EffectSoldering: Soldering

Implementation Method 3

providing electromagnetic shielding and heat release

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12389101B2Image pickup unit and endoscope

Publication Date: 2025.08.12 OLYMPUS MEDICAL SYST CORP

AI summary

An image pickup unit includes an image sensor, a first circuit board on which a first land is disposed around four first side surfaces, a second circuit board on which a second land is disposed around four second side surfaces, a movement detection sensor housed in a recess of the first circuit board, and a rectangular tube bonded to the first land and the second land and sealing the recess in an airtight manner.