Endoscope Image Pickup Unit Thermal Management via Heat Conductive Resin
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Solution Overview
Problem
Existing endoscope image pickup apparatuses face challenges in miniaturization and reliability due to the size and thermal management of the image pickup unit, as well as the mechanical and thermal loads applied during assembly, which affect the reliability and functionality of the device.
Innovation Solution
The design incorporates a stacked optical unit with a smaller image pickup unit and interposer, utilizing a heat conductive resin to manage heat and enhance reliability, and bonds the electric cables or wiring board to the interposer via soldering, ensuring efficient heat transfer and mechanical stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the image pickup unit is miniaturized to reduce the overall size of the endoscope, then the device compactness is improved, but the heat dissipation capability deteriorates due to reduced space for thermal management
Solution Approach 1:
The patent employs a stacked device architecture combining multiple semiconductor devices (image pickup device, signal processing device, and drive power source device) on a single substrate. This composite structure enables efficient heat dissipation by distributing thermal loads across multiple devices while maintaining compact dimensions. The stacked configuration allows heat to be conducted through multiple thermal paths simultaneously, resolving the contradiction between miniaturization and heat dissipation capability.
2Adaptability or versatility
If multiple electronic components are mounted on a wiring board to process image pickup signals, then the functionality is improved, but the device complexity and assembly difficulty increase
Solution Approach 1:
The patent integrates multiple semiconductor devices (image pickup device, signal processing device, and drive power source device) into a single stacked device structure. This merging of functions reduces the number of separate components and simplifies the overall assembly process. The stacked configuration allows all essential signal processing functionalities to be contained within one integrated unit, thereby improving functionality while reducing device complexity and assembly difficulty.
3Volume of moving object
If the image pickup apparatus is miniaturized to fit in the distal end portion of the endoscope, then the insertion capability is improved, but the reliability under mechanical and thermal loads deteriorates
Solution Approach 1:
The patent divides the image pickup apparatus into distinct functional segments arranged in a stacked configuration: the image pickup device, signal processing device, and drive power source device. Each segment is optimized for its specific function and can be independently managed for thermal and mechanical considerations. This segmentation allows the compact apparatus to maintain reliability by distributing stress and thermal loads across multiple specialized components rather than concentrating them in a single unit.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration results in a compact, reliable, and high-functionality image pickup apparatus with improved thermal management, preventing mechanical stress and moisture infiltration, thus enhancing the overall performance and durability of the endoscope.
Implementation Method 1
a heat conductive resin with which a portion among the emitting surface, the first main surface, and a side surface of the image pickup unit is filled
Implementation Method 2
an electric cable or a wiring board bonded to the second electrode by soldering
Data Source
AI summary
An image pickup apparatus for endoscope includes: an optical unit having an incident surface and an emitting surface; an image pickup unit adhering to the emitting surface; an interposer where the image pickup unit is bonded to a first electrode of a first main surface; and an electric cable bonded to the interposer. The image pickup unit is smaller than the optical unit and the interposer in an outer size in a direction orthogonal to an optical axis. The image pickup apparatus for endoscope further includes a heat conductive resin with which a portion among the emitting surface, the first main surface, and a side surface of the image pickup unit is filled. The first electrode extends to a position where the first electrode is brought into contact with the heat conductive resin.