Ultrasmall Endoscope Image Pickup Apparatus Wafer-Level Assembly
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Solution Overview
Problem
Current methods for manufacturing endoscopes with ultrasmall diameters face challenges in producing defective-free image pickup apparatuses with varying specifications, as existing techniques struggle to efficiently integrate and position ultrasmall image pickup units within the laminated optical structure, leading to issues with minimal invasiveness and image quality.
Innovation Solution
The design incorporates a laminated optical portion, an image pickup unit, and a holding portion with specific through-holes and a frame structure that allows precise insertion and positioning of the image pickup unit, using a manufacturing method that involves producing laminated optical and holding wafers with precise through-holes and adhesive layers to ensure accurate alignment and shielding, enabling the production of ultrasmall, high-performance image pickup apparatuses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If wafer level lamination and cutting methods are used to reduce endoscope diameter, then minimal invasiveness is achieved, but defective products cannot be eliminated and manufacturing precision deteriorates
Solution Approach 1:
The patent performs inspection of image pickup devices on the wafer level before the cutting process. By conducting quality checks in advance on the entire wafer, defective devices are identified and excluded before individual image pickup apparatuses are separated through cutting. This preliminary inspection action ensures that only non-defective devices proceed to final assembly, resolving the contradiction between mass production efficiency and defect elimination.
2Productivity
If multiple image pickup apparatuses with different specifications are produced simultaneously, then productivity increases, but device complexity increases
Solution Approach 1:
The patent divides the wafer into multiple regions, with each region designated for a specific type of image pickup apparatus. Different image pickup devices with varying specifications are arranged in predetermined regions on the same wafer. During the cutting process, each region is separated according to its designated type, allowing simultaneous production of multiple apparatus variants while maintaining organized control over the manufacturing process.
3Productivity
If image pickup device wafers are cut after bonding to optical wafers, then manufacturing efficiency improves, but positioning precision of the image pickup unit deteriorates
Solution Approach 1:
The patent performs inspection and selection of image pickup devices on the wafer level before bonding to optical wafers and before cutting. By completing quality assessment and positioning planning in advance, the subsequent bonding and cutting processes can proceed efficiently without compromising positioning precision. The preliminary action ensures that each image pickup device is correctly identified and positioned before the irreversible bonding step.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the efficient production of ultrasmall, high-performance image pickup apparatuses with precise positioning of the image pickup unit, ensuring minimal invasiveness and high reliability, while accommodating various specifications and reducing the risk of defective products.
Implementation Method 1
a first main surface of the third member is glued to the emission surface of the first member
Implementation Method 2
the frame is a frame body that shields light that is incident on the second through-hole from an image pickup side surface that is a side surface of the second member
Implementation Method 3
including an image pickup device to which a cover glass is glued
Data Source
AI summary
An image pickup apparatus includes: a first member, in which a plurality of optical members are laminated; a second member including an image pickup device; and a third member including a spacer and a frame, a first through-hole that penetrates through the spacer and a second through-hole that has a larger sectional area in a direction that perpendicularly intersects an optical axis than a sectional area of the first through-hole and that penetrates through the frame are provided in the third member, the third member is glued to the first member, the second member is disposed in the second through-hole, and a front surface of the second member abuts on a second main surface of the spacer, and the frame is a frame body that shields light that is incident on the second through-hole from an image pickup side surface that is a side surface of the second member.