Endoscope Image Pickup Unit Wiring Exposure Control
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Solution Overview
Problem
Conventional image pickup units for endoscopes face issues with short-circuiting during assembly and use due to exposed current-carrying wiring, which can lead to damage and corrosion, especially when handled with electrically conductive tools and are prone to electric field-induced issues in high humidity environments.
Innovation Solution
The image pickup unit employs a stacked substrate configuration where the end portions of internal wiring are arranged on orthogonal side surfaces, avoiding exposure on certain surfaces to prevent short-circuiting and minimizing electric field generation, thereby enhancing handling and reducing corrosion risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the end portions of internal wirings are exposed on all side surfaces for easy handling and connection, then the ease of operation is improved, but the risk of short-circuiting and corrosion increases
Solution Approach 1:
The patent applies local quality by selectively exposing wiring end portions only on specific side surfaces (first and second side surfaces) while keeping other side surfaces (third and fourth side surfaces) free of exposed wiring. This localized exposure strategy allows handling and connection operations on designated surfaces while preventing short-circuiting on other surfaces, thus resolving the contradiction between ease of operation and reliability.
2Volume of moving object
If the exposed end portions of internal wirings are arranged in multiple layers for compact design, then the volume is reduced, but the electric field-induced issues and corrosion risk increase
Solution Approach 1:
The patent converts the potential harm of exposed wiring end portions into a beneficial configuration by arranging them exclusively on opposite side surfaces (first and second side surfaces) in a controlled manner. This strategic arrangement minimizes electric field interactions between exposed wirings while maintaining compact substrate volume, thus transforming a harmful factor into a manageable design feature.
3Ease of manufacture
If current-carrying wiring is exposed on the end surface for electroplating current carrying, then the manufacturing process is enabled, but the exposed wiring becomes prone to corrosion and short-circuiting
Solution Approach 1:
The patent applies segmentation by dividing the side surfaces into functional zones: first and second side surfaces are designated for wiring exposure and electroplating operations, while third and fourth side surfaces are kept free of exposed wiring. This segmentation allows the electroplating process to be performed on designated surfaces while preventing corrosion and short-circuiting risks on other surfaces.
Data Source
AI summary
The invention includes: an image pickup device having a light receiving surface and a back surface; a first substrate having a first main surface, a second main surface, and four side surfaces, the first substrate comprising a stacked substrate including internal wirings; and a second substrate having a third main surface, a fourth main surface, and four side surfaces. A solder ball on the back surface and an electrode on the first main surface are bonded an electrode on the second main surface and an electrode on the third main surface are bonded, end portions of the internal wirings are, of the four side surfaces, not exposed on a first side surface and a second side surface, and exposed on a third side surface and a fourth side surface, and the exposed end portions are arranged only in a single layer of the stacked substrate.