Endoscope Image Sensor Module Parallel Circuit Board Automation
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Solution Overview
Problem
Existing image pickup modules for endoscopes face challenges in miniaturization, particularly in the assembly of the image sensor, circuit boards, and cable termination, which are not suitable for automated assembly and result in high rejection rates due to faulty connections and complex manual processes.
Innovation Solution
A design featuring two parallel circuit boards with the second board having continuous bores for cable cores and punctiform contact points on the first board for direct electrical contact, allowing for automated assembly and testing of connections without stripping wire jackets, reducing mechanical stress on contact fingers, and enabling efficient miniaturization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the second circuit board has a U-shaped design with wires bent over to contact the first circuit board, then electrical connection is achieved, but the assembly process becomes complex and unsuitable for automated assembly
Solution Approach 1:
The patent divides the electrical connection process into two independent parts: (1) cores are inserted into bores in the second circuit board, and (2) contact fingers on the first circuit board directly contact the exposed core ends. This segmentation eliminates the need for bending wires over the board edge, simplifying the assembly process for automation while maintaining reliable electrical connection.
Solution Approach 2:
Instead of bending wires from the back side of the second circuit board to the front side (conventional approach), the patent inverts the approach by having cores pass through the board and be contacted directly on the front side by contact fingers. This inversion simplifies the assembly process and enables automated manufacturing.
2Reliability
If wire cores are stripped and bent over the circuit board edge to contact the first board, then electrical connection is established, but the process requires manual intervention and increases assembly time
Solution Approach 1:
The cores are pre-inserted into the bores of the second circuit board with their ends exposed on the front surface, eliminating the need for on-site stripping and bending operations. This preliminary preparation of wire positions enables automated assembly processes and significantly increases production speed while ensuring reliable electrical connections.
3Volume of moving object
If the image pickup module is miniaturized, then the size is reduced for endoscope application, but the assembly of components becomes more difficult and error-prone
Solution Approach 1:
The patent segments the assembly into two independent circuit boards with simplified connection interfaces: the first board has contact fingers that directly contact core ends, and the second board has bores for core insertion. This segmentation simplifies the manufacturing process for miniaturized components, reducing assembly difficulty and error rates while enabling compact endoscope integration.
Data Source
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AI summary
An image sensor module (10), in particular for an endoscope, comprises: an electronic image sensor (12) having a plurality of contact fingers (26, 28) arranged in at least one row; a first circuit board (14) having at least one electronic or electrical component (16a, 16b), wherein the first circuit board (14) is arranged parallel to a light-receiving surface (22) of the image sensor (12); a second circuit board (18) arranged on a side of the first circuit board (14) facing away from the image sensor (12) and parallel to the first circuit board (14), wherein the second circuit board (18) has a plurality of bores (64a-64k) distributed continuously and planarly across the second circuit board (18) between its edges from a surface (60, 62) facing away from a surface (60, 62) of the second circuit board (18) facing away from a surface (60, 62) of the second circuit board (18) facing the first circuit board (14); a cable (20) having a plurality of conductors (66),is connected to the second circuit board (18) and leads away from the surface (62) of the second circuit board (18) facing away from the first circuit board (14), wherein the conductors (66) are inserted into the holes (64a-64k) of the second circuit board (18), and ends (68a-68k) of the conductors (66) are located approximately on the surface (16) of the second circuit board (18) facing the first circuit board (14). The first circuit board (14) has a plurality of point-like first electrical contact points (58a-58k) on a surface (48) facing the second circuit board (18), the area distribution of which corresponds to the area distribution of the ends (68a-68k) of the conductors (66) on the surface (60) of the second circuit board (18), wherein the surface (60) of the second circuit board (18) facing the first circuit board (14) is essentially flat overall.and wherein the first circuit board (14) is electrically contacted with the ends of the wires (66) via the first contact points (58a-58k). Furthermore, a method for manufacturing an image sensor module (10) is described (Fig. 1).