Endoscope Image Pickup Unit Recessed Substrate for Stable Soldering
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Solution Overview
Problem
Conventional endoscope image pickup units are difficult to handle and solder due to their small size, requiring stable gripping and connection of cables, which can lead to instability and potential damage during operations.
Innovation Solution
The image pickup unit design includes a recessed portion on the side surface of a second substrate, allowing for stable gripping and soldering by a jig, while minimizing interference with the planar circuit substrate, thereby maintaining a stable attitude during cable connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the image pickup unit is miniaturized to reduce size, then the compactness is improved, but the ease of handling and soldering deteriorates
Solution Approach 1:
The patent introduces a recessed portion on the side surface of the circuit substrate, creating a new spatial dimension for interaction. This recessed portion serves as a gripping feature that extends the handling interface into a third dimension, allowing tools to engage with the miniaturized component without requiring increased overall component size.
Solution Approach 2:
The recessed portion acts as an intermediary structure between the miniaturized image pickup unit and external handling tools. It provides a dedicated interface that mediates the interaction, allowing stable gripping and soldering operations while maintaining the compact size of the image pickup unit itself.
2Stability of the object's composition
If a jig is inserted into the recessed portion to hold the image pickup unit, then the stability during soldering is improved, but the device complexity increases
Solution Approach 1:
The circuit substrate is segmented by introducing a recessed portion that separates the gripping function from the circuit functionality. This segmentation allows the recessed portion to serve as a dedicated mechanical interface for stability during soldering, while the main substrate continues to provide electrical functions without added complexity.
Solution Approach 2:
The recessed portion is nested within the circuit substrate structure, creating a hierarchical arrangement where the gripping feature is integrated into the existing substrate geometry. This nesting approach provides stability during soldering without requiring separate external fixtures or additional complex structural elements.
3Ease of operation
If the circuit substrate is gripped from the side surfaces, then the ease of gripping is improved, but the risk of damage increases
Solution Approach 1:
The recessed portion creates a localized gripping feature with specific geometric properties that are optimized for tool engagement. This local quality enhancement provides easy gripping through the recessed geometry while the rest of the fragile circuit substrate remains protected from direct mechanical stress during soldering operations.
Data Source
AI summary
The image pickup unit includes an image pickup device, a first substrate, and a second substrate that are connected in this order. The second substrate includes a side surface formed in a direction crossing a light-receiving surface of the image pickup device. The second substrate includes, in the side surface thereof, a recessed portion into which a jig is inserted to hold the image pickup unit.