Endoscope Imager Substrate Layout for Electrostatic Shielding
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Solution Overview
Problem
Endoscopes with imager circuit components are susceptible to static electricity interference due to the proximity of solder connection parts to the outer surface, affecting signal input and output, particularly as they become smaller in diameter and imager circuit components shrink in size.
Innovation Solution
The image capturing unit design includes a cable core wire connected to a flexible board opposite to the imager's direction, with a hard substrate and flexible board positioned to shield the solder connection from external static interference, and the cable connection is placed farther from the imager mounting position, enhancing electrostatic resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the solder connection part of the cable is positioned close to the outer circumferential surface and imager circuit components to reduce device size, then the endoscope diameter and component size are reduced, but the electrostatic resistance of imager components deteriorates due to susceptibility to external static electricity
Solution Approach 1:
The patent repositions the solder connection part from a location near the outer circumferential surface to a location on the opposite side of the first substrate relative to the imager. This spatial rearrangement in the vertical dimension (through the substrate thickness) separates the cable connection from both the imager circuit components and the outer surface, reducing electrostatic susceptibility while maintaining compact device dimensions.
Solution Approach 2:
The first substrate acts as an intermediary barrier between the solder connection part and the imager circuit components. By positioning the solder connection part on the opposite side of the substrate from the imager, the substrate itself serves as a physical and electrostatic shield, protecting sensitive imager components from external static electricity while allowing compact integration.
2Device complexity
If the cable connection is positioned close to the imager mounting position to simplify assembly, then manufacturing complexity is reduced, but signal integrity deteriorates due to static electricity interference
Solution Approach 1:
Instead of positioning the cable connection near the imager in the horizontal plane (which would simplify assembly but expose signals to static interference), the patent utilizes the vertical dimension by routing the cable through the first substrate to connect on the opposite side. This maintains manageable assembly complexity while significantly improving signal integrity by isolating connections from electrostatic interference.
Data Source
AI summary
The present invention includes an imager, a cable that coats a cable core wire for performing at least one of inputting and outputting of signals between the imager and outside and supply of power to the imager from the outside, a first substrate that connects the imager to a first surface, and a second substrate that is connected to a first connection part different from a connection position of the imager on a second surface opposite to the first surface of the first substrate. In the cable core wire, relative to the second surface of the first substrate, at least part of a second connection part connected to the second substrate is positioned on a side opposite to a direction in which an image capturing surface of the imager is directed.