Endoscope Imaging Module Ceramic Substrate Miniaturization
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Solution Overview
Problem
Conventional imaging modules for endoscopes face challenges in manufacturing reliability due to fragile wirings in flexible substrates and high costs and complexity in multilayer ceramic substrates, which affect the module's size and accuracy.
Innovation Solution
The design incorporates a solid-state image sensing device connected via a connector with implanted conductors and grooves, a coaxial cable with internal and sheath conductors, and a housing with a resin portion, ensuring stable connections and reduced layer complexity while maintaining high reliability and miniaturization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a flexible substrate with through-hole interconnection is used, then the imaging module can be made small and flexible, but the wirings are likely to be broken and manufacturing reliability is low
Solution Approach 1:
The patent changes the fundamental parameter of substrate rigidity from flexible to rigid (ceramic), eliminating the wiring breakage issue while maintaining small size through optimized ceramic substrate design and integrated conductor structures
Solution Approach 2:
The patent uses a multilayer ceramic substrate combining multiple materials (ceramic base, conductive pastes, adhesives, resin coatings) to achieve both small size and high reliability, with each layer performing specific functions while working together as an integrated structure
2Reliability
If a T-shaped multilayer ceramic substrate is used, then manufacturing reliability is high, but the number of layers must be large which increases size and manufacturing cost
Solution Approach 1:
The patent merges multiple functions into fewer layers by integrating conductor patterns, insulating structures, and connection terminals directly into the ceramic substrate layers, reducing the total layer count while maintaining high reliability through the inherent strength of ceramic material
Solution Approach 2:
The patent transitions from a planar T-shaped multilayer structure to a three-dimensional integrated structure where conductors and insulators are arranged in multiple dimensions within the ceramic substrate, achieving compact integration without requiring excessive layers
3Device complexity
If layers are adhesively attached to form T-shaped multilayer structure, then the number of layers decreases, but it is extremely difficult to maintain accuracy of positions at which layers are attached
Solution Approach 1:
The patent incorporates positioning structures (protrusions and recesses) and alignment marks into the ceramic substrate layers during manufacturing, enabling precise alignment before adhesive attachment and eliminating position accuracy issues
Solution Approach 2:
The patent replaces purely adhesive-based alignment with a mechanical interlocking system using protrusions and recesses that physically guide and secure layer positions, ensuring high precision attachment without relying solely on adhesive control
Data Source
AI summary
An imaging module of the invention includes: a connector including: a first implanted conductor; a second implanted conductor longer than the first implanted conductor; a first groove that includes a second mounting terminal constituting part of the first implanted conductor; a second groove that includes a third mounting terminal constituting part of the second implanted conductor; and a third groove that is located between the first groove and the second groove; and a coaxial cable including: an internal conductor that is provided in the first groove and is electrically connected to the second mounting terminal; a sheath conductor that is provided in the second groove and is electrically connected to the third mounting terminal; and a coated portion that is provided in the third groove.