Endoscope Imaging Module Stepped Board Miniaturization
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Solution Overview
Problem
Existing imaging modules face challenges in miniaturization as they struggle to reduce the projected area while maintaining a compact axial dimension, which affects the flexibility of the endoscope's distal tip.
Innovation Solution
The imaging module design features an image sensor and passive components mounted on opposite sides of a mounting board with stepped surfaces and a columnar cable connection block, allowing for efficient use of space and minimizing the projected area without significantly increasing the axial dimension.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If passive components are mounted on the bottom surface of the cable connection board, then multiple passive components can be implemented, but the projected area of the cable connection board becomes large
Solution Approach 1:
The patent transitions from mounting passive components only on the bottom surface (2D plane) to mounting them on multiple surfaces including the side surface of the cable connection board (3D utilization). This dimensional expansion allows components to be distributed across greater surface area without increasing the projected footprint, resolving the contradiction between component quantity and projected area.
Solution Approach 2:
The patent utilizes the vertical space and side surfaces of the cable connection board structure itself to mount passive components. By nesting components on the side surfaces and integrating the mounting structure within the existing board geometry, the design accommodates multiple components without expanding the overall projected area of the assembly.
2Quantity of substance
If the component mounting surface is extended in the axial direction, then multiple passive components can be mounted, but the axial dimension of the imaging module increases
Solution Approach 1:
Instead of extending mounting surfaces axially (1D extension), the patent utilizes the radial dimension by mounting components on the side surface of the cable connection board. This redirects the mounting strategy from axial extension to radial utilization, allowing multiple components to be accommodated without increasing the axial dimension of the imaging module.
Solution Approach 2:
The patent employs asymmetric mounting arrangements where passive components are positioned on different surfaces (bottom surface and side surface) at different orientations. This asymmetric distribution optimizes space utilization within the available volume, accommodating multiple components while maintaining a compact axial profile through non-uniform spatial arrangement.
3Area of stationary object
If the projected area of the imaging module is reduced, then miniaturization is achieved, but the axial dimension may increase affecting distal tip maneuverability
Solution Approach 1:
The patent reduces projected area by utilizing the vertical and side surfaces of the cable connection board for component mounting rather than expanding the horizontal footprint. By stacking components vertically and mounting them on side surfaces, the design achieves miniaturization in the radial direction while controlling axial dimension growth, thereby maintaining distal tip maneuverability.
Solution Approach 2:
The patent applies different mounting strategies to different local regions of the cable connection board. Passive components are selectively mounted on the bottom surface and side surface based on their specific requirements, optimizing space utilization in each local region. This localized approach allows the overall projected area to be minimized while accommodating all necessary components without excessive axial extension.
Data Source
AI summary
An imaging module includes: an image sensor; and a mounting board on which the image sensor is mounted together with a plurality of passive components. The mounting board includes: a first surface on which the image sensor is surface-mounted; a second surface that is located on an opposite side to the first surface and on which the passive component is mounted; a third surface that is continuous with the second surface via a step and on which the passive component is mounted; and a columnar cable connection block that rises from the second and third surfaces and to which a cable is connected.