Resin-Embedded Endoscope Imaging Module Without Outer Frame
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Solution Overview
Problem
Conventional imaging modules for endoscopes face challenges in durability against external environments and require complex assembly techniques, with existing solutions often relying on mount substrates and outer frames that complicate manufacturing and increase costs.
Innovation Solution
The proposed imaging module integrates an imager with an optical member and electronic components within a resin portion, where the imager and electronic components are embedded such that their incidence and front surfaces are exposed, and connected via through wiring to external terminals, eliminating the need for a mount substrate or outer frame, thus enhancing durability and simplifying assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an image sensor is enclosed with an outer frame and sealed with resin material, then durability against external environments is improved, but device complexity increases due to the additional outer frame structure
Solution Approach 1:
The patent removes the outer frame structure from the imaging module, extracting only the essential resin sealing portion that directly contacts and protects the image sensor. This eliminates the complex multi-layer frame assembly while maintaining environmental protection through the resin encapsulation alone.
Solution Approach 2:
The patent merges the functions of the outer frame and sealing resin into a single integrated resin portion that simultaneously provides structural support and environmental sealing. The resin encapsulation serves both as the protective housing and the sealant, eliminating the need for separate frame and gasket components.
2Strength
If mount substrates and outer frames are used to enclose the image sensor, then protection and structural support are provided, but manufacturing complexity and costs increase
Solution Approach 1:
The patent employs a resin encapsulation that acts as a flexible yet protective shell surrounding the image sensor. This thin-film resin coating provides adequate mechanical protection and environmental sealing without requiring rigid frame structures, simplifying both manufacturing and assembly processes.
Solution Approach 2:
The patent uses composite resin materials that combine structural support properties with sealing capabilities. The resin formulation integrates multiple functions (protection, sealing, mounting) into a single material system, reducing the need for multiple different materials and assembly steps.
3Productivity
If the image sensor is mounted on a substrate and enclosed in a wafer-like state, then mass production is enabled, but the module size and complexity increase
Solution Approach 1:
The patent segments the manufacturing process into two main stages: wafer-level mounting of multiple image sensors in parallel, followed by individual resin encapsulation. This segmentation enables high-volume production through wafer processing while keeping the final assembly simple through automated dipping or coating of the resin sealant.
Solution Approach 2:
The resin encapsulation process is designed to be self-aligning, where the resin automatically conforms to the image sensor and mounting substrate geometry without requiring complex alignment fixtures or manual adjustment. The viscous resin flows to fill gaps and creates a natural seal, eliminating the need for precision alignment mechanisms during sealing.
Data Source
AI summary
An imaging module includes an imager having an optical member on a light receiving surface, an electronic component having a front surface facing the same direction as the one to which an incidence surface of the optical member faces, a resin portion that has a first surface flush with the incidence surface of the optical member and the front surface of the electronic component, and a second surface that is a surface on a side opposite to the first surface while having the imager and the electronic component being embedded therein such that the incidence surface and the front surface are exposed to the first surface, an external connection terminal provided on the second surface, and a through wiring that extends through the resin portion to connect at least one of the imager and the electronic component with the external connection terminal.