Multi-layer Substrate Signal Routing for Endoscope Imaging Modules
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Solution Overview
Problem
Endoscope imaging modules face interference between drive and image signals due to their close proximity on the substrate, leading to noise in the image signal, which affects the quality of in-vivo imaging.
Innovation Solution
The imaging module separates the image and drive signal wiring patterns onto different conductor layers of a multi-layer substrate, with at least one electronic component embedded inside the substrate, allowing these signals to be transmitted through distinct paths, reducing crosstalk and noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the imaging module is reduced in size with drive and image signal transmission paths arranged close to each other on the substrate, then the miniaturization of the imaging module is achieved, but the drive signal interferes with the image signal to generate noise
Solution Approach 1:
The patent transitions from planar signal routing to three-dimensional layered routing by separating drive signals and image signals into different conductor layers of the substrate. This vertical separation in the Z-dimension eliminates electromagnetic interference while maintaining compact footprint, directly resolving the contradiction between miniaturization and signal interference reduction.
Solution Approach 2:
The patent divides the substrate into multiple conductor layers, with drive signals routed through one layer and image signals routed through another layer. This segmentation of signal paths into distinct layers prevents crosstalk and interference, allowing the imaging module to be miniaturized without compromising signal quality.
2Device complexity
If wiring patterns for drive and image signals are arranged close to each other on the substrate, then the device complexity is reduced, but crosstalk between signals increases
Solution Approach 1:
The patent resolves the contradiction by moving signal routing from a two-dimensional plane to a three-dimensional layered structure. Drive signals and image signals are transmitted through different conductor layers, which simplifies the wiring arrangement while simultaneously eliminating crosstalk and improving signal transmission quality.
Solution Approach 2:
The substrate is segmented into multiple conductor layers, with each layer dedicated to specific signal types. This segmentation allows for simplified wiring design within each layer while preventing interference between different signal types, thereby maintaining both low complexity and high reliability.
3Volume of moving object
If the imaging module is miniaturized, then the insertion unit can be more easily inserted into the body cavity, but the separation between signal paths is reduced leading to noise
Solution Approach 1:
The patent achieves miniaturization while maintaining precise signal path separation by utilizing the vertical dimension through multiple conductor layers. This allows the imaging module to be compact in planar dimensions while preserving adequate separation between drive and image signals in the vertical dimension, thus eliminating noise without sacrificing miniaturization benefits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively minimizes signal interference, enhancing image quality by isolating the image and drive signals, thereby reducing noise and improving the reliability of in-vivo imaging.
Implementation Method 1
a solid state image sensor having a light-receiving surface and configured to receive light and to perform photoelectric conversion on the received light to generate an electrical signal
Data Source
AI summary
An imaging module includes: an image sensor; a substrate having a conductor layer and extending from the image sensor; a multi-layer substrate having therein conductor layers on the substrate; electronic components mounted on/in the multi-layer substrate; an image signal electrode pad and a drive signal electrode pad on the image sensor; an image signal cable; a drive signal cable; an image signal wiring pattern through which an image signal is transmitted from the image signal electrode pad to the image signal cable; and a drive signal wiring pattern through which a drive signal is transmitted from the drive signal cable to the drive signal electrode pad. At least one of the electronic components is embedded inside the multi-layer substrate. The image signal wiring pattern and the drive signal wiring pattern are separated into different conductor layers of the substrate and the multi-layer substrate due to the embedded electronic component.