Endoscope Imaging Unit Circuit Board Thickness Design
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Solution Overview
Problem
Conventional endoscope imaging units face challenges in maintaining horizontal orientation and efficient production due to the thickness of the circuit board, particularly at the inspection electrode area, which affects the accuracy and cost of manufacturing.
Innovation Solution
The design incorporates a wall portion with a height greater than the electronic components around the electronic component mounting area and a thinner maximum thickness at the inspection electrode area, allowing the imaging unit to remain horizontal without special jigs, and enables early detection of defective products through inspection electrodes, reducing production costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the circuit board is made thicker to accommodate electronic components and wall portions, then the structural support and component mounting capability are improved, but the horizontal orientation accuracy and production efficiency deteriorate due to the need for special jigs and increased complexity
Solution Approach 1:
The circuit board is designed with non-uniform thickness, featuring a first thickness in the electronic component mounting area (to provide structural support) and a second, smaller thickness in the inspection electrode area (to enable horizontal orientation without special jigs). This local differentiation resolves the contradiction by providing strength where needed while maintaining production efficiency where inspection occurs.
2Strength
If the circuit board thickness is increased to provide structural support, then the mechanical strength is improved, but the manufacturing precision and cost effectiveness deteriorate due to the need for special jigs and complex production processes
Solution Approach 1:
The circuit board implements local quality differentiation with varying thickness across different functional areas. The electronic component mounting area has greater thickness for mechanical strength, while the inspection electrode area has reduced thickness to ensure horizontal orientation accuracy during manufacturing, eliminating the need for special jigs and complex production processes.
3Ease of manufacture
If the wall portion height is increased to support electronic components, then the component mounting capability is improved, but the device complexity and production cost increase due to the need for additional structural elements
Solution Approach 1:
The wall portion serving the electronic component mounting area is merged with the circuit board structure itself, forming an integrated support structure. This eliminates the need for separate support elements, reducing device complexity while maintaining component mounting capability. The wall portion is formed as an integral part of the circuit board through a single manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design ensures accurate and cost-effective production of endoscope imaging units by maintaining horizontal orientation and facilitating quality inspection, thereby improving the overall efficiency and reliability of the imaging unit.
Implementation Method 1
an image sensor provided on a front surface side of the semiconductor package and a sensor electrode provided on a back surface side of the semiconductor package, the image sensor being configured to receive light made incident from the optical system and perform a photoelectric conversion to generates an electric signal
Data Source
AI summary
An imaging unit includes: an optical system configured to collect light; a semiconductor package including an image sensor and a sensor electrode; a plurality of electronic components; and a circuit board including: a first connection electrode provided on a front surface side of the circuit board; and an electronic component mounting area and an inspection electrode disposing area that are provided on a back surface side of the circuit board. A wall portion having a height higher than a height of the plurality of electronic components is formed at least on two facing sides around the electronic component mounting area, and a maximum thickness of the circuit board at the inspection electrode disposing area is thinner than a thickness of the circuit board including the wall portion, at the electronic component mounting area.