Endoscope Light Source Heat Sink Inversion for Compact Cooling
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Solution Overview
Problem
Conventional light source devices for endoscopes face challenges in effectively managing heat generated by solid-state light emitting elements, which can lead to increased device size and reduced cooling efficiency due to the traditional configuration of heat sinks and heat pipes.
Innovation Solution
The light source device incorporates a unique configuration where the heat sink is positioned lower than the light source unit, with a heat pipe system consisting of first and second heat pipes connected to the heat generation body and heat sink, optimizing heat transfer and reducing device height by positioning heat sinks lower than the light source unit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the heat sink is positioned at a higher height to improve heat dissipation, then cooling efficiency is improved, but the device height increases
Solution Approach 1:
The patent inverts the conventional arrangement by positioning the heat sink below the light source unit rather than above it. This inversion allows heat to be conducted downward through the heat pipe to the heat sink, achieving effective cooling while reducing the overall device height and preventing the heat sink from protruding outward.
Solution Approach 2:
The patent utilizes the vertical dimension by arranging the heat sink at a lower height than the light source unit, creating a three-dimensional heat dissipation pathway. The heat pipe connects these components vertically, allowing heat transfer in the height direction while optimizing space utilization and reducing the device's external dimensions.
2Temperature
If the distance between heat source and heat sink is reduced to improve heat transfer, then cooling performance is improved, but the heat pipe configuration becomes more complex
Solution Approach 1:
The patent divides the heat pipe system into multiple segments: a first heat pipe connecting the light source unit to an intermediate heat dissipation structure, and a second heat pipe connecting the heat sink to the same or adjacent structure. This segmentation allows for optimized thermal pathways while maintaining manageable component sizes and assembly complexity.
Solution Approach 2:
The patent introduces an intermediate heat dissipation structure that serves as a mediator between the light source unit and the heat sink. This intermediate structure receives heat from the light source via the first heat pipe and transfers it to the heat sink via the second heat pipe, facilitating efficient heat transfer while simplifying the overall configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances cooling performance while downsizing the device, effectively managing heat generated by solid-state light emitting elements and preventing an increase in device size, thereby improving overall efficiency and reliability.
Implementation Method 1
a heat pipe connected with the heat generation body and the heat sink
Data Source
AI summary
A light source device includes has a configuration in which a height of a heat sink from a reference surface when the reference surface is a bottom surface of a housing is set to be lower than a height of a light source unit from the reference surface, and a heat pipe includes a first heat pipe, a first end part of which is connected with the heat generation body and a second end part of which is connected with the heat sink, and a second heat pipe, a third end part of which is connected with a heat generation body and a fourth end part of which is connected with the heat sink so that a distance to the second end part is longer than a distance between the first end part and the third end part.