Endoscope Image Pickup Optical Module with Angled Rigid Substrates

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Solution Overview

Problem

The challenge in endoscope design is to minimize the diameter of the insertion portion while transmitting high-pixel image signals effectively, as traditional electrical signal transmission via metal wires increases the diameter, and bending flexible substrates with orthogonal surfaces for optical signal conversion is difficult.

Innovation Solution

An image pickup apparatus with an optical module having a predetermined angle between its surfaces, coupled with an optical fiber and a ferrule, and a wiring board with rigid and flexible components, allowing for efficient optical signal transmission and easy assembly, while maintaining a thin profile.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If electrical signal transmission via metal wires is used to transmit high-pixel image signals, then the signal transmission capability is improved, but the diameter of the insertion portion increases

Engineering Contradiction:
Improvesignal transmission capabilityVSAvoiddiameter of insertion portion
Core Design Contradiction:
Quantity of substanceVSLength of stationary object

Solution Approach 1:

The patent replaces electrical signal transmission via metal wires with optical signal transmission via optical fibers. The imager converts optical images to electrical signals, which are then converted to optical signals by an optical device and transmitted through optical fibers to the operation portion. This substitution enables high-pixel image signal transmission while maintaining a thin insertion portion diameter, as optical fibers have smaller diameters than the metal wire bundles required for equivalent electrical signal transmission.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Quantity of substance

If a flexible substrate with orthogonal surfaces is used for optical device mounting, then the optical signal conversion capability is improved, but the ease of bending and assembly deteriorates

Engineering Contradiction:
Improveoptical signal conversion capabilityVSAvoidease of bending and assembly
Core Design Contradiction:
Quantity of substanceVSEase of manufacture

Solution Approach 1:

The patent transitions from a two-dimensional flexible substrate mounting approach to a three-dimensional rigid substrate structure with specific angular orientations. The first substrate has the optical device mounted at a predetermined angle (e.g., 45 degrees) relative to its surface, and the second substrate is positioned at a predetermined angle relative to the first substrate. This angular/dimensional configuration enables effective optical signal conversion while simplifying the bending and assembly process compared to attempting to bend a flexible substrate into an orthogonal configuration.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enables minimal invasive endoscope design with efficient optical signal transmission, reducing the risk of damage during bending and ensuring reliable image pickup, while maintaining a compact size.

Implementation Method 1

an optical device configured to convert the image pickup signal into an optical signal

Methodology Applied
Scientific EffectElectro-optic conversion: Electro-Optic Effects

Implementation Method 2

an optical fiber configured to transmit the optical signal and configured to be optically coupled with the optical device

Methodology Applied
Scientific EffectOptical signal transmission: Optical Fibre

Data Source

PatentUS11435570B2Image pickup apparatus for endoscope, endoscope, and manufacturing method of image pickup apparatus for endoscope
Publication Date: 2022.09.06 OLYMPUS CORPORATION(JP)
  • US11435570B2 patent drawing
  • US11435570B2 patent drawing
  • US11435570B2 patent drawing

AI summary

An image pickup apparatus for endoscope includes: an imager, an optical device, an optical module on which the optical device is mounted, an optical fiber optically coupled with the optical device, a ferrule having an insertion hole into which the optical fiber is inserted, and a wiring board including a first rigid board, a second rigid board and a flexible intermediate board. The ferrule is fixed to the second rigid board or a first principal surface of the optical module. A first side surface of the optical module is glued to the first rigid board, and the first principal surface is glued to the second rigid board.