Compact Optical Module for Endoscopes Using Substrate Integration

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Solution Overview

Problem

There is a challenge in reducing the diameter and length of optical modules, particularly those used in endoscopes, while maintaining high transmission efficiency and reliability for optical signal transmission.

Innovation Solution

The optical module design includes a VCSEL optical element, a ferrule holding optical fiber, and a configuration of substrates and side surface substrates with electrodes, allowing for compact integration with signal cables and efficient optical signal transmission, using ceramic substrates and resin for stability and reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If optical signal transmission via optical fiber is used instead of electric signal transmission via metal wire, then transmission efficiency and reliability are improved, but device complexity and manufacturing difficulty increase

Engineering Contradiction:
Improvetransmission efficiencyVSAvoidmodule complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent integrates the optical element, optical fiber, signal cable, and electrical connection into a single unified module structure. The optical element is mounted on the substrate with the optical fiber positioned directly against its light-emitting or light-receiving surface, while signal cables are bonded to electrodes on the same substrate, combining optical and electrical functions in one compact unit.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The substrate serves multiple functions simultaneously: it mounts the optical element, positions the optical fiber, provides electrical connection through electrodes, and bonds signal cables. This multi-functional design reduces the need for separate components and simplifies the overall module structure while maintaining high transmission efficiency.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Ease of operation

If compact integration is achieved to reduce diameter and length, then ease of operation and minimal invasiveness are improved, but manufacturing precision requirements increase

Engineering Contradiction:
Improveminimal invasivenessVSAvoidalignment precision
Core Design Contradiction:
Ease of operationVSManufacturing precision

Solution Approach 1:

The optical fiber is positioned in advance against the light-emitting or light-receiving surface of the optical element during module assembly. The substrate is designed with predetermined positions for the optical element, optical fiber, and electrodes, allowing components to be integrated in a fixed sequence without requiring complex real-time alignment adjustments during manufacturing.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The substrate acts as an intermediary platform that pre-establishes the spatial relationships between the optical element, optical fiber, and signal cables. By bonding these components to the substrate at predetermined locations, the module achieves compact integration while reducing the precision requirements for final assembly, as the substrate itself provides the alignment framework.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Device complexity

If multiple components are integrated on a single substrate, then device complexity is reduced, but manufacturing precision requirements increase

Engineering Contradiction:
Improvemodule structureVSAvoidcomponent placement precision
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

The module is segmented into distinct functional zones on the substrate: the optical element mounting area, the optical fiber positioning area, and the signal cable bonding area with electrodes. This segmentation allows each component to be placed and bonded independently at its designated location, simplifying the manufacturing process while maintaining precise spatial relationships between components.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design results in a compact, high-efficiency optical module with reduced noise susceptibility and ease of manufacturing, suitable for endoscopic applications with minimal invasiveness and high reliability.

Implementation Method 1

an optical element including a light emitting section or a light receiving section

Methodology Applied
Scientific EffectLight emitting: Light Emitting Diode

Implementation Method 2

an optical element including a light emitting section or a light receiving section

Methodology Applied
Scientific EffectLight receiving: Photoelectric Effect

Implementation Method 3

an optical fiber for transmitting the optical signal

Methodology Applied
Scientific EffectOptical signal transmission: Optical Fibre

Implementation Method 4

a signal cable for transmitting an electric signal, a distal end portion of which is bonded to the electrode of the side surface substrate

Methodology Applied
Scientific EffectElectric signal transmission: Conduction (electrical)

Data Source

PatentUS10750941B2Optical module, image pickup module, and endoscope
Publication Date: 2020.08.25 OLYMPUS CORPORATION(JP)
  • US10750941B2 patent drawing
  • US10750941B2 patent drawing
  • US10750941B2 patent drawing

AI summary

An optical module includes an optical element, a first substrate, on a first principal plane of which the optical element is mounted, a holding member disposed on a second principal plane of the first substrate, an optical fiber inserted into a through hole of the holding member, a holding substrate with an opening, a wall surface of which is in contact with an outer peripheral surface of the holding member, an interconnecting substrate connecting the first substrate and the holding substrate, a side surface substrate, an end portion of which is connected to the holding substrate and on which an electrode is disposed, and a signal cable, a distal end portion of which is bonded to the electrode of the side surface substrate.