Endoscope Optical Unit Adhesion Method
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Solution Overview
Problem
Existing manufacturing methods for optical units in endoscopes face challenges in size reduction for low invasiveness, as they struggle to adhere optical elements without adhesive protrusion into the optical path, which affects optical properties, and require high-precision patterning with insufficient adhesive strength for reliability.
Innovation Solution
A manufacturing method involving the fabrication of element wafers with optical path and spacer portions, using a solid first adhesive for initial adhesion and a liquid second adhesive to fill gaps, ensuring no adhesive protrudes into the optical path, with precise patterning and curing processes to achieve strong adhesion and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive is used to adhere optical elements, then adhesion strength is improved, but adhesive protrusion into the optical path occurs which deteriorates optical properties
Solution Approach 1:
The adhesive application process is segmented into two distinct stages: first applying adhesive to specific regions (optical element regions) and then filling remaining gaps. This segmentation allows precise control over adhesive placement, ensuring strong adhesion where needed while preventing protrusion into the optical path.
Solution Approach 2:
Different adhesive application strategies are applied to different regions: the optical element regions receive adhesive first for strong bonding, while the optical path region is filled afterward to eliminate gaps without causing protrusion. This local differentiation resolves the contradiction between adhesion strength and optical property preservation.
2Object-affected harmful factors
If high-precision patterning is used to prevent adhesive protrusion, then optical properties are improved, but manufacturing complexity increases
Solution Approach 1:
Adhesive is preliminarily applied to the optical element regions before filling the optical path region. This preliminary action ensures that adhesive is already in position for strong bonding, and the subsequent gap-filling step simply eliminates remaining spaces without requiring complex patterning, thereby reducing manufacturing complexity.
Solution Approach 2:
The adhesive application process utilizes the natural flow and curing characteristics of the adhesive material. The adhesive self-limits its spread to prevent protrusion, and the curing process automatically stabilizes the structure, reducing the need for complex external patterning controls.
3Length of moving object
If optical unit diameter is reduced for low invasiveness, then invasiveness is improved, but adhesion reliability deteriorates
Solution Approach 1:
The adhesive application continues in two continuous steps: first covering the optical element regions, then filling all remaining gaps. This continuous action ensures complete and reliable adhesion throughout the entire optical unit structure, maintaining adhesion reliability even as the diameter is reduced for low invasiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enables the creation of thin-diameter optical units with high reliability and easy manufacturing, ensuring no adhesive protrudes into the optical path, thus enhancing the optical properties and invasiveness of the endoscope.
Implementation Method 1
adhering the element wafers opposed to each other with a first adhesive portion composed of a solid first adhesive
Implementation Method 2
injecting a liquid second adhesive in a gap between the spacer portions
Implementation Method 3
performing curing treatment on the liquid second adhesive to form a second adhesive portion
Data Source
AI summary
A manufacturing method of an optical unit for endoscope includes: a process of fabricating a plurality of element wafers each including an optical element having an optical path portion and a spacer portion; a first adhesion process of fabricating a laminated wafer by adhering the element wafers with a first adhesive portion composed of a solid first adhesive disposed in a gap between the spacer portions; a second adhesion process of fabricating a bonded wafer by injecting a liquid second adhesive in the gap between the spacer portions; a curing process of performing curing treatment on the second adhesive; and a process of cutting the bonded wafer.