Resin Sealing for Endoscope Imaging Reliability
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Solution Overview
Problem
Existing imaging apparatus for endoscopes face challenges in achieving high physical and electrical reliability due to voids and unreliable resin filling, which can lead to reduced reliability and increased size, especially when using resins without proper physical properties or frames for sealing.
Innovation Solution
The use of a first resin with a low thixotropic ratio for sealing electronic components and a second resin with a higher thixotropic ratio for sealing signal cable connections, along with a third resin for bonding and fixing, ensures effective sealing and compactness without voids, enhancing physical and electrical reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a frame is provided at the outer circumference of the imaging section to facilitate resin filling, then the resin can be filled more easily and voids can be decreased, but the cost of components increases and the diameter of the circumference of the imaging section becomes thick
Solution Approach 1:
The patent removes the frame structure from the imaging section, extracting the unnecessary component that caused increased complexity and size. Instead of using a frame to facilitate resin filling, the patent relies on the natural capillary action and proper resin selection to achieve void-free filling without additional structural elements.
Solution Approach 2:
The patent changes the physical parameters of the resin by carefully selecting resins with appropriate viscosity and curing characteristics. This parameter optimization allows the resin to flow properly into all spaces and cure without voids, eliminating the need for a frame structure.
2Length of moving object
If the diameter of the insertion section is reduced to decrease burden on the test subject, then the endoscope becomes more comfortable, but the wiring module must be made more compact which increases difficulty in resin sealing
Solution Approach 1:
The patent adjusts the physical parameters of the resin, particularly viscosity and curing time, to accommodate the compact wiring module geometry. This allows proper resin flow and void-free filling in the constrained space without requiring larger dimensions.
Solution Approach 2:
The patent uses composite resin formulations that combine appropriate viscosity modifiers and curing agents to achieve optimal filling characteristics for the compact wiring module, ensuring reliable sealing in the reduced-size configuration.
3Reliability
If multiple resins with different properties are used for sealing electronic components and cable connections, then physical and electrical reliability is improved, but the manufacturing process becomes more complex
Solution Approach 1:
The patent applies different resin formulations to different regions: a first resin for sealing electronic components and a second resin with higher thixotropic ratio for sealing cable connections. This local differentiation optimizes reliability for each specific sealing requirement while maintaining overall manufacturing feasibility.
Solution Approach 2:
The patent modifies the thixotropic ratio parameter of the resin to create two distinct formulations with appropriate flow characteristics for their respective applications, enabling reliable sealing of different components without requiring overly complex manufacturing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach prevents voids and ensures high physical and electrical reliability of the imaging apparatus without increasing its size, allowing for a more compact and reliable endoscope design.
Implementation Method 1
a first resin which seals the plurality of electronic components, and a second resin which seals a connection part of the plurality of signal cables, the second resin having a thixotropic ratio which is higher than a thixotropic ratio of the first resin
Implementation Method 2
a second resin which seals a connection part of the plurality of signal cables, the second resin having a thixotropic ratio which is higher than a thixotropic ratio of the first resin
Data Source
AI summary
An imaging apparatus includes an observation optical system, a solid state imaging element photoelectrically converting an image from the observation optical system, a flexible board electrically connected to the solid state imaging element, a plurality of electronic components and a plurality of signal cables electrically connected to the flexible board, and a first resin sealing the electronic components and a second resin sealing a connection part of the signal cables. A thixotropic ratio of the first resin is set to be lower than a thixotropic ratio of the second resin. Accordingly, apparatus and an endoscope, which can be made compact, and have high physical and electrical reliability without increasing a size of the imaging apparatus, are provided.