Endoscope Imaging Sensor Connection Strength via 3D Protrusions
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Solution Overview
Problem
The connection strength between solid-state imaging elements and circuit substrates in endoscopes is insufficient due to reduced size, leading to potential separation under load or angle operations during manufacturing or usage.
Innovation Solution
The use of a rigid ceramic circuit substrate with high bending stiffness and a flexible wiring substrate connected via a connector, ensuring a robust connection area of at least 10% of the imaging area, and employing a connector system to enhance reliability and assembly ease.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the solid-state imaging element is reduced in size, then the imaging device can be miniaturized, but the connection strength between the imaging element and circuit substrate deteriorates
Solution Approach 1:
The patent transitions from a single-plane terminal arrangement to a three-dimensional structure by forming protrusions that extend vertically from the circuit substrate surface. This vertical dimensionality increase allows terminals to engage with imaging element connection portions from multiple levels, significantly enhancing connection strength despite the reduced imaging element size.
Solution Approach 2:
The circuit substrate employs a composite structure combining a base substrate with protrusions made of conductive material (such as metal). This composite construction provides both mechanical support from the substrate and enhanced electrical/mechanical connection capability from the protruding conductive elements, solving the strength issue while maintaining miniaturization.
2Area of moving object
If the connection area between imaging element and circuit substrate is reduced, then the imaging device size is reduced, but the reliability of connection deteriorates
Solution Approach 1:
By extending terminals vertically as protrusions from the circuit substrate, the patent creates a multi-level connection interface. This three-dimensional arrangement increases the effective connection area and engagement points without increasing the horizontal footprint, thereby maintaining connection reliability while enabling device miniaturization.
Solution Approach 2:
The connection interface is segmented into multiple discrete protrusion structures distributed across the circuit substrate. Each protrusion provides an independent connection point, and the collective array of segmented connections ensures reliable signal and power transmission while occupying minimal area.
3Ease of manufacture
If the connection structure is simplified, then the manufacturing process is easier, but the connection strength under load deteriorates
Solution Approach 1:
The patent modifies the geometric parameters of the connection structure by changing from flat terminals to vertically extended protrusions with specific dimensions (height, width, spacing). These parameter changes enhance load-bearing capacity while maintaining compatibility with standard manufacturing processes such as plating and molding, thus achieving both strength and ease of manufacture.
Data Source
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AI summary
The endoscope includes an imaging device that is provided in a tip portion of an insertion part capable of being inserted into a body cavity. The imaging device includes an image sensor that photoelectrically converts imaging light incident on an image receiving surface thereof through an imaging lens provided in a lens barrel, and a circuit substrate including a connecting surface facing a terminal face that is a surface opposite to the image receiving surface of the image sensor. A plurality of terminals are uniformly arranged longitudinally and laterally in a two-dimensional matrix form on the terminal face of the image sensor, and the connecting surface of the circuit substrate and the terminal face of the image sensor are connected to each other through the plurality of terminals. The total area of the plurality of terminals on the terminal face occupies 10% or more of the area of an imaging area of the image receiving surface.