Endoscope Image Sensor Package With Spacer-Mounted LED Illumination

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Solution Overview

Problem

Conventional endoscopes are bulky, have low light utilization efficiency, non-uniform illumination, and are prone to shadows and blind spots due to the complex structure and fabrication process, which limits their miniaturization and effective illumination.

Innovation Solution

The image sensor package positions LEDs on a spacer connected to a substrate with the image sensor, allowing flexible layout and optimizing the height difference between the light output surfaces of the LEDs and the light input surface of the image sensor, enhancing illumination and image quality.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If light-emitting elements and image sensor are disposed on a flexible circuit board with cables soldered and encapsulated in injection-molding, then the structure is fixed and assembled, but the structure becomes complicated and the endoscope size increases

Engineering Contradiction:
Improvestructural stabilityVSAvoidfabrication process complexity
Core Design Contradiction:
Stability of the object's compositionVSDevice complexity

Solution Approach 1:

The patent merges the light-emitting elements and image sensor onto a single substrate, eliminating the need for separate flexible circuit boards and reducing the number of assembly steps. The substrate integrates both components with their respective electrical connections, simplifying the overall structure and fabrication process while maintaining structural stability.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The substrate serves multiple functions simultaneously: it acts as the mounting platform for both light-emitting elements and image sensor, provides electrical connections for both components, and serves as the structural base for the entire imaging assembly. This multi-functionality reduces the need for separate specialized components.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Ease of manufacture

If light-emitting elements are disposed on a flexible circuit board away from the image sensor, then the assembly is easier, but light utilization efficiency decreases and illumination uniformity deteriorates

Engineering Contradiction:
Improveassembly easeVSAvoidlight utilization efficiency
Core Design Contradiction:
Ease of manufactureVSIllumination intensity

Solution Approach 1:

The patent positions light-emitting elements at specific locations around the image sensor on the substrate, creating localized illumination zones that directly correspond to the sensor's active area. This strategic placement ensures optimal light delivery to each region of the sensor, maximizing light utilization efficiency while maintaining uniform illumination across the entire field of view.

Inventive Principle:
Principle #3Local quality

3Device complexity

If light-emitting elements are disposed away from the image sensor, then the layout is simpler, but shadows and blind spots increase

Engineering Contradiction:
Improvelayout complexityVSAvoidshadows and blind spots
Core Design Contradiction:
Device complexityVSObject-affected harmful factors

Solution Approach 1:

The patent employs an asymmetric arrangement of light-emitting elements positioned at different locations around the image sensor, including side and corner positions. This asymmetric configuration ensures comprehensive illumination coverage from multiple angles, eliminating shadows and blind spots that would occur with symmetric or distant placements, while keeping the layout relatively simple.

Inventive Principle:
Principle #4Asymmetry

4Device complexity

If the height difference between light output surface of LEDs and light input surface of image sensor is not optimized, then the structure is simpler, but illumination quality and image quality deteriorate

Engineering Contradiction:
Improvestructural complexityVSAvoidillumination quality
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

The patent optimizes the height difference parameter between the light output surface of LEDs and the light input surface of the image sensor to a specific range. This parameter optimization ensures that light is delivered at the optimal distance and angle, maximizing illumination quality and image quality without requiring complex additional structures such as lenses or reflectors.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration reduces the endoscope's size, improves illumination uniformity, and minimizes shadows, resulting in better imaging performance.

Implementation Method 1

The light-emitting element includes a spacer and at least one LED

Methodology Applied
Scientific EffectLight-emitting diode: Light Emitting Diode

Implementation Method 2

light-emitting diodes (LEDs) are disposed on a spacer

Methodology Applied
Scientific EffectElectroluminescence: Electroluminescence

Data Source

PatentUS12483772B2Image sensor package and endoscope
Publication Date: 2025.11.25 MEDIMAGING INTEGRATED SOLUTION INC
  • US12483772B2 patent drawing
  • US12483772B2 patent drawing
  • US12483772B2 patent drawing

AI summary

An image sensor package includes a substrate, an image sensor, and at least one light-emitting element. The substrate has a plurality of electric-conduction contacts. The image sensor is arranged on the substrate electrically connected with the substrate. The light-emitting element includes a spacer and a light-emitting diode. The spacer has a plurality of electric-conduction contacts. The light emitting diode is arranged on the spacer and electrically connected with the spacer. The spacer is arranged on the substrate and electrically connected with the substrate. The spacer has a predetermined thickness, so that the height of a light input surface of the image sensor is larger than or equal to the height of a light output surface of the light-emitting diode. The above-mentioned image sensor package favors optimization of illumination. An endoscope including the above-mentioned image sensor package is also disclosed.