Endoscope Image Sensor Assembly for Pressure-Free PCB Mounting
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Solution Overview
Problem
Existing endoscope designs face challenges in mounting image sensors without applying pressure on the sensor, circuit board, and associated wiring, leading to potential damage and connection issues.
Innovation Solution
The electronic package for endoscopes positions the image sensor orthogonal to the endoscope's long axis, using electrical contacts on the rear surface and a printed circuit board with arms to support and connect the sensor without bending, facilitating secure and pressure-free mounting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If existing mounting techniques are used for image sensors in endoscopes, then the image sensor can be mounted within the scope, but pressure is applied on the image sensor, circuit board, and wiring which causes potential damage and connection issues
Solution Approach 1:
The patent transitions from planar mounting of the image sensor to a three-dimensional configuration where the sensor is positioned at an angle relative to the endoscope axis. The circuit board is oriented perpendicular to the endoscope axis, allowing the image sensor to be mounted without applying pressure along the longitudinal axis. This spatial reconfiguration eliminates the pressure problem while maintaining reliable electrical connections through properly positioned contact elements.
2Ease of manufacture
If the image sensor is mounted using conventional methods, then mounting is achieved, but bends are required which apply pressure on the image sensor, circuit board, and wiring
Solution Approach 1:
The patent employs a three-dimensional mounting architecture where the circuit board is positioned perpendicular to the endoscope axis and the image sensor is mounted at an angle on the circuit board. This eliminates the need for bends in the longitudinal direction, maintaining structural integrity while simplifying the manufacturing process. The contact elements are designed to engage with the image sensor without requiring bending operations.
3Manufacturing precision
If conventional image sensor mounting is used, then the sensor can be positioned, but pressure is applied causing potential damage
Solution Approach 1:
The patent repositions the image sensor in a three-dimensional configuration on the circuit board, oriented at an angle relative to the endoscope axis. This spatial arrangement allows the sensor to be mounted with high precision while eliminating pressure application that could cause damage. The contact elements are designed to establish reliable electrical connections without exerting harmful forces on the image sensor or surrounding components.
Data Source
AI summary
Disclosed solutions relate to an electronic package for a medical device. In an example, the electronic package includes an electronic device with a rear device surface having a device electrical contact. The device further includes a printed circuit board (PCB) having a PCB surface with one or more electrical traces and an edge surface transverse to the PCB surface. The edge surface faces and is spaced from the rear device surface. The package further includes an electrical component fixed to the PCB surface and electrically connected with the device electrical contact and the one or more electrical traces.