Endoscope Image Sensor Cable Terminal Structure for Low-Thickness Bonding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing methods for connecting semiconductor members and electric cables in endoscope image pickup devices face issues with damage due to heat or stress generated during bonding, and result in a large thickness of the image pickup apparatus when bonded to a wiring board.
Innovation Solution
A semiconductor device design featuring a semiconductor member with external electrodes, a terminal member with core wire terminals, a wiring layer with insulation and conductive wiring, and a resin layer that fixes the components without covering the external surfaces, allowing for secure bonding of an electric cable to the core wire terminal without using solder, thereby reducing the risk of damage and maintaining a small size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an electric cable is bonded to the external electrode of the image pickup device, then electrical connectivity is achieved, but the image pickup device may be damaged due to heat or stress generated at the time of bonding
Solution Approach 1:
The patent introduces a terminal member as an intermediary component between the image pickup device and the electric cable. The terminal member includes a core wire electrode that connects to the image pickup device and a core wire terminal that connects to the electric cable, thereby preventing direct bonding of the cable to the sensitive image pickup device and avoiding heat or stress damage
Solution Approach 2:
The connection structure is segmented into distinct functional parts: the image pickup device, the terminal member (with core wire electrode and core wire terminal), and the electric cable. This segmentation allows each component to perform its specific function while isolating the image pickup device from harmful bonding processes
2Reliability
If the image pickup device is bonded to a wiring board, then electrical connectivity and structural support are achieved, but the thickness of the image pickup apparatus increases
Solution Approach 1:
The patent transitions from a planar wiring board configuration to a three-dimensional terminal member structure. The terminal member extends vertically with the core wire electrode connecting to the image pickup device and the core wire terminal extending outward for cable connection, eliminating the need for a large-thickness wiring board while maintaining electrical connectivity
Data Source
AI summary
An image pickup apparatus includes: an image pickup member having a first surface and a second surface, an external electrode being disposed on the second surface; a terminal where a core wire terminal is disposed on a first upper surface and a core wire electrode is disposed on a lower surface; a wiring layer including an insulation layer and a wiring, the wiring being in contact with the external electrode and the core wire electrode, a third surface being in contact with the second surface and the lower surface; a resin layer disposed on the third surface, an outer dimension of the resin layer being equal to an outer dimension of the wiring layer, the resin layer fixing the image pickup member and the terminal; and an electric cable including a core wire bonded to the core wire terminal.