Endoscope Image Sensor Wiring Layout for Shorter Distal Tips
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Solution Overview
Problem
Existing image pickup apparatuses for endoscopes face challenges in miniaturization and manufacturing efficiency due to the spacing and arrangement of bonding electrodes, which affects the length and reliability of the distal end portion.
Innovation Solution
The design includes a resin member with parallel main surfaces, an image pickup member with external electrodes on the back surface, fan-out wirings extending between the inside and outside parts of the image pickup member, and through wirings connecting these electrodes, allowing for a compact optical system with easy bonding of electric cables to bonding electrodes without directly applying stress or heat to the image pickup device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If bonding electrodes are arranged on the image pickup device at narrow pitch, then the number of electrodes can be increased, but the manufacturing precision and reliability deteriorate due to spacing constraints
Solution Approach 1:
The patent transitions from arranging bonding electrodes directly on the image pickup device surface to arranging them on the resin layer surface, which is an extended dimensional space. This allows electrodes to be positioned at wider intervals while maintaining electrical connectivity through through-wirings, thereby increasing manufacturability without sacrificing electrode quantity.
Solution Approach 2:
The resin layer serves as an intermediary medium between the image pickup device and the bonding electrodes. Through-wirings penetrate the resin layer to connect the bonding electrodes on the resin surface to the image pickup device, enabling electrode arrangement at optimal spacing for manufacturing while maintaining electrical functionality.
2Length of moving object
If the distal end portion of the endoscope is shortened, then the invasiveness is reduced, but the space for wiring and bonding becomes insufficient
Solution Approach 1:
The patent utilizes the resin layer as an extended space beyond the image pickup device boundaries to arrange fan-out wirings and bonding electrodes. This dimensional extension allows complex wiring arrangements to be accommodated within the shortened distal end portion, resolving the conflict between miniaturization and wiring complexity.
Solution Approach 2:
The wiring structure is segmented into multiple functional layers: fan-out wirings on the resin layer surface, through-wirings penetrating the resin, and bonding electrodes connecting to the image pickup device. This segmentation allows each component to be optimized independently, enabling compact overall design while maintaining wiring functionality.
3Ease of manufacture
If bonding electrodes are arranged at long intervals on a large area resin layer, then the manufacturing ease is improved, but the electrical connection reliability may deteriorate
Solution Approach 1:
Through-wirings act as intermediary connectors that reliably transmit electrical signals from the bonding electrodes on the resin surface to the image pickup device. This intermediary structure ensures stable electrical connection even when bonding electrodes are spaced at optimal manufacturing intervals rather than tightly packed.
Data Source
AI summary
An image pickup apparatus for endoscope includes a resin member in which an outer dimension of a third main surface is equal to an outer dimension of a second main surface, an image pickup member having a light receiving surface smaller than the second main surface, and having a first external electrode on a back surface covered by the resin member, a fan-out wiring provided to extend between an inside and an outside of an extension space, the extension space being an extension of the image pickup member in an optical axis direction, a first through wiring penetrating through the resin member, and provided in the inside of the extension space, a first bonding electrode connected with the external electrode through the first through wiring and the fan-out wiring and forming the fan-out wiring provided on the third main surface, and an electric cable bonded to the first bonding electrode.