Endoscope Light Module Side-Surface Wiring for Compact Distal Tips
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Solution Overview
Problem
Existing endoscopes lack a suitable arrangement for the conductive portion connecting the power supply line to the illumination device, leading to potential issues with stress, bending, and reduced connection strength.
Innovation Solution
The endoscope incorporates a light emitting module with an annular mounting substrate and a conductive portion on the side surface, connected to the power supply line in a parallel configuration, ensuring proper arrangement and reducing stress on the connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the conductive portion is arranged on the mounting substrate without considering suitable positioning, then the connection between power supply line and light emitting elements can be established, but stress and bending occur on the power supply line, reducing connection strength
Solution Approach 1:
The conductive portion is moved from the first surface (top view plane) to the side surface (vertical plane) of the mounting substrate. This dimensional transition allows the power supply line to connect to the light emitting elements without experiencing bending stress, as the conductive portion is positioned at the peripheral edge where vertical connection is possible. The side surface arrangement eliminates the horizontal bending that would occur with top-surface mounting.
Solution Approach 2:
The side surface of the mounting substrate serves as an intermediary structure between the power supply line and the light emitting elements. By providing a conductive portion on the side surface, the patent creates a intermediate connection point that allows the power supply line to reach the light emitting elements without direct bending, thus protecting the connection from stress while maintaining electrical connectivity.
2Length of moving object
If the distal end portion size is reduced to improve insertion performance, then insertion capability is enhanced, but arrangement space for conductive portions and image sensors becomes limited
Solution Approach 1:
The conductive portion is positioned on the side surface of the mounting substrate rather than on the first surface. This vertical placement on the peripheral edge utilizes the height dimension of the substrate, effectively adding arrangement space without increasing the horizontal footprint. This allows smaller distal end portion dimensions while still accommodating all necessary conductive connections.
Solution Approach 2:
The mounting substrate is functionally segmented into different surfaces with distinct purposes: the first surface for mounting light emitting elements and the side surface for conductive connections. This segmentation allows optimized use of space, with the side surface peripheral edge providing connection points that do not interfere with the central image sensor area, thus maximizing space utilization in compact configurations.
3Measurement precision
If the image sensor size is increased to improve imaging quality, then observation capability is enhanced, but the distal end portion becomes larger and more complex
Solution Approach 1:
By positioning conductive portions on the side surface at the peripheral edge, the horizontal space on the first surface is freed up. This allows the image sensor to be enlarged for better imaging quality without increasing the overall distal end portion complexity, as the conductive connections are handled vertically on the side surface rather than occupying horizontal space.
Solution Approach 2:
The side surface of the mounting substrate is given a specialized local quality as a conductive connection zone. This localized functional differentiation allows the central first surface to be dedicated entirely to the image sensor and light emitting elements, while the side surface handles electrical connections. This local specialization enables larger image sensors without adding complexity to the overall structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This arrangement enhances the connection strength and reduces the size of the distal end portion, allowing for a larger image sensor and more light emitting elements, while maintaining insulation and heat dissipation.
Implementation Method 1
a light emitting module which incorporates a plurality of light emitting elements
Implementation Method 2
a conductive portion electrically connected to the light emitting elements is provided on the side surface, and a power supply line for supplying power to the light emitting elements is connected to the conductive portion
Data Source
AI summary
An endoscope includes a light emitting module incorporated in a distal end portion of an insertion tube, the light emitting module includes a mounting substrate on which a plurality of light emitting elements is mounted, the mounting substrate has an annular shape in which a hole through which an image sensor using the light emitting elements as a light source is to be inserted is provided in a central portion and includes a first surface on which the light emitting elements are surface-mounted and a side surface located at a peripheral edge of the first surface, a conductive portion electrically connected to the light emitting elements is provided on the side surface, and a power supply line for supplying power to the light emitting element is connected to the conductive portion.