Endoscope Soldering Segmentation for Autoclave Reliability
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Solution Overview
Problem
Electronic components in endoscope apparatuses, such as CMOS sensors, face reliability issues due to high temperature sterilization processes, which can cause solder degradation and connectivity failures.
Innovation Solution
The endoscope apparatus employs a second electronic component with a high-stress-resistant solder and a bonding member with a glass transition point higher than the circuit board, ensuring robust electrical connections and maintaining integrity during autoclave sterilization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electronic components are mounted on circuit boards using conventional soldering, then manufacturing is simple and cost-effective, but the solder degrades during high-temperature sterilization causing reliability issues
Solution Approach 1:
The patent divides the mounting structure into two distinct segments: a first circuit board with conventional soldering for non-sterilized components, and a second circuit board with high-temperature-resistant soldering for sterilized components. This segmentation allows each segment to use the most appropriate mounting technique for its specific requirements, resolving the contradiction between reliability and complexity.
Solution Approach 2:
The patent applies different soldering qualities to different locations: conventional solder is used for the first circuit board where high-temperature resistance is not critical, while high-temperature-resistant solder is used for the second circuit board where sterilization exposure requires enhanced thermal stability. This local differentiation optimizes both reliability and manufacturing complexity.
2Duration of action of stationary object
If high-temperature-resistant materials are used for sterilized components, then durability during autoclave sterilization is improved, but manufacturing complexity increases
Solution Approach 1:
The patent segments the electronic components into two groups: those requiring sterilization resistance (mounted on second circuit board) and those not requiring it (mounted on first circuit board). This segmentation allows high-temperature-resistant materials to be used only where necessary, improving sterilization durability while minimizing the impact on manufacturing ease.
Solution Approach 2:
The patent changes the material parameter (solder type) specifically for components exposed to sterilization. By selecting solder with higher melting points and thermal stability for the second circuit board, the patent enhances sterilization resistance without requiring all components to use these specialized materials, thus maintaining ease of manufacture for the majority of components.
3Ease of manufacture
If conventional soldering is used for all components, then manufacturing is simple, but solder deterioration occurs during autoclave sterilization
Solution Approach 1:
The patent applies different solder qualities to different locations based on their operational requirements. Conventional solder is used for the first circuit board where thermal exposure is minimal, maintaining manufacturing simplicity. High-temperature-resistant solder is used for the second circuit board where sterilization exposure threatens connection stability, thus preventing solder deterioration where it matters most.
Solution Approach 2:
The patent changes the solder material parameters (melting point, thermal stability) specifically for the second circuit board that undergoes autoclave sterilization. This parameter change ensures solder connection stability during high-temperature sterilization while keeping the first circuit board's conventional soldering simple and cost-effective.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses solder deterioration and maintains reliable electrical connections under high-temperature sterilization conditions, enhancing the durability and performance of the endoscope apparatus.
Implementation Method 1
a bonding member bonded to the second electronic component and the second circuit board, the bonding member having a glass transition point higher than that of the second circuit board
Data Source
AI summary
According to one exemplary embodiment, an endoscope apparatus includes: an insertion unit that is an object to be disinfected by boiling; an operation unit connected to the insertion part; a main unit connected to the operation unit; a first circuit board embedded in the main unit; a first electronic component electrically connected to the first circuit board via a first solder; a second circuit board embedded in at least any one of the insertion unit and the operation unit; a second electronic component electrically connected to the second circuit board via a second solder having higher stress resistance than that of the first solder; and a bonding member bonded to the second electronic component and the second circuit board, the bonding member having a glass transition point higher than that of the second circuit board.