Multi-layer Substrate Electrode Placement for Endoscope Hard Part Length
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Solution Overview
Problem
Existing endoscopes face challenges in minimizing the length of the hard part at the distal end, which is necessary to reduce the load on the subject during medical procedures, as the current methods for connecting signal cables are complex and require significant components that hinder miniaturization.
Innovation Solution
The proposed solution involves an imaging device with a multi-layer substrate that includes core and shielded-wire connection electrodes on opposing surfaces, allowing for the connection of coaxial cables using a heater chip and laser light to melt solder, thereby simplifying the connection process and reducing the length of the hard part.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If traditional signal cable connection methods are used with collective cable removal and jig-based positioning, then connection reliability is maintained, but the length of the hard part increases and device complexity increases
Solution Approach 1:
The patent transitions from planar connection (all electrodes on one surface) to three-dimensional connection (electrodes on opposite surfaces). The core connection electrode is formed on the first surface while the shielded-wire connection electrode is formed on the second surface adjacent to the first surface, enabling vertical stacking and reducing horizontal space requirements. This dimensional change allows for shorter hard part length while maintaining connection integrity.
Solution Approach 2:
The patent implements nested positioning where the core of the coaxial cable is positioned within the shielded wire structure. The core connection electrode and shielded-wire connection electrode are arranged concentrically, with the core centered relative to the shielded wire. This nested arrangement optimizes space utilization and reduces the overall length of the hard part while ensuring reliable electrical connections.
2Ease of manufacture
If complex cable drawing and positioning processes are used, then connection precision is achieved, but manufacturing complexity and time increase
Solution Approach 1:
The patent pre-forms the core connection electrode and shielded-wire connection electrode on opposite surfaces of the multi-layer substrate before cable assembly. The electrodes are positioned and prepared in advance with appropriate spacing and orientation, eliminating the need for complex jig-based positioning during final assembly. This preliminary preparation simplifies the manufacturing process while ensuring precise cable alignment.
Solution Approach 2:
The patent replaces mechanical jig-based positioning systems with a structured multi-layer substrate design that inherently guides and positions the coaxial cable. The geometric arrangement of electrodes on opposite surfaces, combined with the nested core-shielded wire configuration, provides self-aligning features that reduce dependency on complex mechanical positioning equipment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables easier connection of signal cables to the multi-layer substrate, shortening the length of the hard part of the endoscope, improving connection reliability, and reducing the load on the subject during medical procedures.
Implementation Method 1
heating the shielded wire by using a heater chip from the height direction of the multi-layer substrate
Implementation Method 2
applying heat by emitting laser light or soft beam to the conductive land formed in a direction of the third surface of the shielded-wire connection electrode from a direction of the third surface of the multi-layer substrate to melt solder
Data Source
AI summary
An imaging device that includes at least one lens that collects light incident from an object; an imaging sensor that receives light from the lens and converts it to an electric signal; a multi-layer substrate electrically connected to the imaging sensor that includes electronic components and conductive layers and vias; and a collective cable including at least one coaxial cable. A core connection electrode connected to a core of the coaxial cable is formed on a first surface of the multi-layer substrate, the first substrate intersecting with a height direction of the multi-layer substrate. A shielded-wire connection electrode connected to a shielded wire of the coaxial cable is formed on a side surface of the multi-layer substrate adjacent to the first surface. The side surface faces and the cable extend to a proximal end.