Endoscope Window Temperature Sensor Encasement

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Solution Overview

Problem

Existing endoscopes face challenges in maintaining accurate temperature control for the window and adjacent sections due to variations in the shape and thickness of the potting compound surrounding the temperature sensor, affecting both temperature measurement accuracy and mechanical protection.

Innovation Solution

An endoscope design featuring a temperature sensor embedded in a potting compound within an encasement, such as a dome or ring, ensures consistent shape and improved heat transfer, using thermoplastic materials and UV-curing adhesives to maintain precise temperature control and mechanical protection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If the temperature sensor is embedded in a potting compound without an encasement, then the device complexity is reduced, but the manufacturing precision and measurement precision deteriorate due to variations in potting compound shape and thickness

Engineering Contradiction:
Improvestructure complexityVSAvoidpotting compound shape consistency
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

An encasement structure is introduced as an intermediary component between the temperature sensor and the potting compound. This encasement serves as a mediator that defines and constrains the shape of the potting compound, ensuring consistent geometry without requiring complex manufacturing processes. The encasement acts as a template that guarantees reproducible potting compound dimensions while keeping the overall device structure relatively simple.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The invention changes the geometric parameters of the potting compound by using an encasement with predefined dimensions. Instead of relying on free-form potting where thickness and shape vary, the encasement fixes these parameters (radius, height, shape) to specific values, ensuring manufacturing precision and consistency in temperature sensor embedding.

Inventive Principle:
Principle #35Parameter changes

2Ease of manufacture

If the potting compound thickness varies, then the ease of manufacture is improved, but the measurement precision and temperature control accuracy deteriorate

Engineering Contradiction:
Improveassembly simplicityVSAvoidtemperature measurement accuracy
Core Design Contradiction:
Ease of manufactureVSMeasurement precision

Solution Approach 1:

The encasement acts as an intermediary that standardizes the potting compound thickness and shape. By providing a physical constraint structure, it ensures that the potting compound maintains uniform thickness throughout, which is critical for accurate temperature sensing and measurement precision while remaining easy to manufacture through simple filling processes.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Reliability

If the temperature control range is tightened to within a few Kelvin, then the reliability is improved, but the device complexity and control difficulty increase

Engineering Contradiction:
Improvetemperature control reliabilityVSAvoidcontrol system complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The invention replaces complex mechanical or electronic temperature control mechanisms with a simpler thermal conduction-based system. The heating device and temperature sensor are positioned to directly measure and control the window temperature through thermal conduction, achieving reliable temperature control within a narrow range without requiring complex control algorithms or systems.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

4Measurement precision

If the temperature sensor is exposed without embedding, then the measurement precision is improved, but the strength and mechanical protection deteriorate

Engineering Contradiction:
Improvetemperature sensing accuracyVSAvoidmechanical protection
Core Design Contradiction:
Measurement precisionVSStrength

Solution Approach 1:

The encasement serves as a protective intermediary structure that shields the temperature sensor from mechanical damage while maintaining its sensing capability. The encasement provides a rigid housing that protects the fragile temperature sensor during assembly and operation, ensuring both mechanical strength and measurement precision are maintained.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The invention uses a composite structure combining the temperature sensor, potting compound, and encasement. This composite design integrates the sensing function with mechanical protection, where the encasement provides structural strength and the potting compound ensures proper thermal contact, achieving both protection and measurement precision simultaneously.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design achieves consistent temperature measurement and control accuracy, enhancing the mechanical protection of the temperature sensor and improving the operational reliability of the endoscope by fixing the shape of the potting material with low tolerance.

Implementation Method 1

By means of the heating device, the window of the endoscope is heated to an elevated temperature even before it is inserted into the patient's abdominal cavity, so that the risk of condensation is significantly reduced.

Methodology Applied
Scientific EffectHeating: Heating

Implementation Method 2

the heating device comprising a temperature sensor which is disposed embedded in a potting material in the region of the window

Methodology Applied
Scientific EffectTemperature sensing: Thermistor

Implementation Method 3

it has proved useful to embed the temperature sensor in a potting compound, e.g. in a drop of adhesive, also known as a 'glob-top'

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11918183B2Endoscope
Publication Date: 2024.03.05 OLYMPUS WINTER & IBE GMBH
  • US11918183B2 patent drawing
  • US11918183B2 patent drawing

AI summary

An endoscope, including: at least one outer shaft tube, at least one inner shaft tube disposed within the at least one outer shaft tube; a window distally hermetically sealing one of the inner shaft tube or the outer shaft tube, a heater disposed proximate to the window between the at least one outer shaft tube and the at least one inner shaft tube, a temperature sensor disposed embedded in a potting compound proximate to the window, and an encasement filled with the potting compound, the encasement at least partially surrounding the temperature sensor.