Endoscope Window Solder Preform Sealing for Hermetic Assembly
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Solution Overview
Problem
Existing methods for producing endoscopes with hermetically sealed windows are complex and require specialized solders resistant to caustic chemicals, making it difficult to create autoclavable and chemically stable endoscopes with easily introduced windows.
Innovation Solution
A method involving a window with metallic coatings and a soldering preform is used, where the preform is heated to distribute soldering material between the window and the endoscope shaft, forming a hermetic and chemically stable solder layer without adhesives, allowing for self-centering and void-free soldering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a window is inserted into an endoscope shaft and hermetically sealed using conventional methods (metallization and soldering), then the endoscope achieves chemical stability and autoclavability, but the manufacturing process becomes complex and requires specialized solders resistant to corrosive chemicals
Solution Approach 1:
The invention extracts the complexity of selecting and applying specialized corrosion-resistant solders by using a preform with pre-applied solder material. The preform contains the necessary solder in a controlled form that can be easily positioned and activated, removing the complex steps of solder selection, preparation, and application from the manufacturing process.
Solution Approach 2:
The solder material is preliminarily prepared and positioned on the preform before the actual sealing operation. This preliminary action ensures that the correct amount and type of solder is already in place, eliminating the need for complex real-time soldering operations and specialized knowledge during the sealing process.
2Reliability
If conventional soldering methods are used to seal the window, then hermetic sealing is achieved, but the process requires specialized solders that are not attacked by corrosive chemicals used for cleaning
Solution Approach 1:
The preform acts as an intermediary carrier that holds the corrosion-resistant solder material in a controlled, pre-positioned state. This intermediary device simplifies the manufacturing process by eliminating the need for manual handling and application of specialized solders, making window insertion easier while maintaining chemical stability requirements.
3Reliability
If the window is hermetically sealed with complex metallization and soldering processes, then autoclavability and chemical resistance are achieved, but the manufacturing time and process steps increase
Solution Approach 1:
The invention merges multiple steps (metallization, solder preparation, positioning, and application) into a single integrated preform component. This consolidation reduces the number of separate manufacturing operations required, thereby improving productivity while maintaining the hermetic seal quality necessary for autoclavability.
4Reliability
If manual soldering and gluing methods are used for sealing windows and optical components, then hermetic sealing is achieved, but the process is time-consuming and requires multiple different sealing techniques
Solution Approach 1:
The invention changes the physical state and application parameters of the solder material by using a preform with pre-positioned solder. This allows the solder to be applied in a controlled, predetermined amount and location, eliminating the time-consuming variations associated with manual soldering and gluing techniques while maintaining hermetic seal quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the soldering process, ensures a hermetic and chemically stable seal, and allows for the production of autoclavable and chemically stable endoscopes with easily introduced windows, enhancing the durability and reliability of the endoscope.
Implementation Method 1
heating, preferably simultaneously heating, the solder preform at several points or, preferably simultaneously, heating the entire solder preform by means of a heating device
Implementation Method 2
so that the flowable solder material of the solder preform is distributed between the window and the window receptacle
Data Source
Figure 1
Figure 2
Figure 3a~3b
AI summary
The invention relates inter alia to a method for manufacturing an endoscope (2). The method comprises the following steps: - providing a window (20, 64) having a lateral circumferential surface (22) and two planar surfaces (26), wherein the window (20, 64) is provided with a metallic coating (24) on the lateral circumferential surface (22) and/or in the edge region of a planar surface (26) of the window (20, 64), and wherein one or the planar surface (26) of the window (20, 64), preferably provided with the metallic coating (24), is or is provided with a solder preform (40), - inserting the window (20, 64) provided with the solder preform (40) into a window receptacle of an endoscope shaft (4) of the endoscope, wherein, in particular, the planar surface (26) of the window (20, 64) provided with the solder preform (40) faces the interior of the endoscope shaft (4) or is shielded from the interior of the endoscope shaft (4) is turned away, - heating, preferably simultaneous heating,the solder preform (40) is heated at several points or, preferably simultaneously, the entire solder preform (40) is heated by means of a heating device (50, 70), so that the flowable solder material of the solder preform (40) is distributed between the window (20, 64) and the window receptacle and, after cooling of the solder material, a solder is arranged between the window (20, 64) and the window receptacle.