Endoscopic Lens Module Array Assembly for Miniaturized Sensor Alignment
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Solution Overview
Problem
Conventional endoscopic lens assemblies are too large for miniaturization, and wafer-level package processes suffer from low yield, high cost, and inflexibility in adjusting optics specifications.
Innovation Solution
A manufacturing method involving a positioning base with lens barrel channels and alignment marks, where lenses are assembled layer by layer, resin-filled, and light-shielding material is used to form optical-blocking layers, allowing integration with image sensors to create compact optical image sensor modules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If barrel-type lens module assembly method is used, then ease of manufacture is improved, but device size becomes too large for miniaturization
Solution Approach 1:
The patent merges the lens module and image sensor into a single integrated array-type optical image sensor module. Multiple lenses are arranged in an array on a substrate and directly bonded to the image sensor, eliminating the need for separate barrel-type lens modules and their complex alignment mechanisms. This integration achieves miniaturization while maintaining ease of manufacture through standardized array processing.
2Volume of moving object
If wafer-level package process is used, then device size is reduced, but manufacturing precision deteriorates due to inability to automatically align lenses and image sensors
Solution Approach 1:
The patent incorporates alignment marks on the substrate before lens assembly. These pre-formed alignment marks enable automatic alignment devices to precisely position and bond the image sensor to the lens array. By preparing the alignment infrastructure in advance, the method achieves both miniaturization and high manufacturing precision through automated processes.
3Volume of moving object
If wafer-level package process is used, then device size is reduced, but yield deteriorates due to inability to screen damaged image sensors
Solution Approach 1:
The patent enables inspection and screening of damaged image sensors before final lens bonding. The array-type structure allows individual sensor elements to be tested and identified. Defective sensors can be detected and excluded from the assembly process, providing feedback that prevents defective units from proceeding to subsequent steps, thereby maintaining high yield rates while achieving miniaturization.
4Volume of moving object
If wafer-level lens is used, then device size is reduced, but adaptability deteriorates as optics specifications cannot be adjusted
Solution Approach 1:
The patent creates an adaptable optical system where lens parameters such as field of view and depth of field can be adjusted after manufacturing. The modular array structure allows for reconfiguration or replacement of lens elements to change optical specifications. This dynamic capability enables the same miniaturized platform to serve multiple applications with different optical requirements, maintaining versatility while achieving compact size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method reduces assembly size, enhances yield and precision, lowers costs, and allows flexible adjustment of optics specifications, facilitating high-quality image capture.
Implementation Method 1
filling a resin material into the gaps between the plurality of lenses to fix the plurality of lenses adhesively
Implementation Method 2
filling a light-shielding material into the plurality of glue flowing runners and curing the light-shielding material to wrap the sidewalls of the plurality of glue flowing runners
Data Source
AI summary
A manufacturing method of an endoscopic lens module involves arranging multiple lens barrel channels and alignment marks on a positioning base, placing lenses into the channels, and using adhesive material to fix them to form the lens module. A flat glass layer is placed on the other side of the positioning base, and the positioning base is then cut according to the alignment marks to create glue flowing runners. Light-shielding material is injected into the glue flowing runners and cured to form the array-type optical image sensor module. Finally, the light-shielding material is cut along the sidewalls of the glue flowing runners to separate the base units and create multiple optical image sensor modules of endoscopic lens assemblies. Therefore, the present invention enables the efficient mass production of high-quality optical image sensor modules of endoscopic lens assemblies and allows flexible configuration of image sensors to achieve optimal imaging results.