Endoscopic Light Source-Imaging Module Design
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Solution Overview
Problem
Conventional endoscopic light source-imaging modules are too large and difficult to assemble due to the need for bending substrates and multiple resin-filling processes, which limits their use in small-size endoscopes and reduces production efficiency.
Innovation Solution
The module comprises a substrate with an image sensor and illumination module, where the height difference is adjusted using a carrier, and a single-use opaque mold with through-holes and runners for resin filling, eliminating the need for substrate bending and reducing module size and assembly complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the substrate is bent to adjust the heights of the image sensing device and illumination module, then the relative height can be optimized, but the module size increases and assembly becomes difficult
Solution Approach 1:
The height adjustment function is segmented from the substrate bending process. Instead of bending the entire substrate to adjust heights, the patent uses independent height-adjustable mounting structures for the image sensing device and illumination module. This allows precise height optimization without complicating the overall assembly process.
2Reliability
If resin is filled into the region between the sensor and light shielding cap to secure them, then structural security is improved, but the module size increases due to the need for resin-filling needle access
Solution Approach 1:
The resin filling process is extracted from the conventional approach where a needle must access the region between components. Instead, the patent uses a bottom-filling method where resin is injected from the bottom of the module, eliminating the need for large access spaces and reducing the overall module volume while maintaining structural security.
3Reliability
If multiple resin-filling processes are used to secure different components, then structural security is improved, but production efficiency decreases
Solution Approach 1:
Multiple resin-filling processes are merged into a single bottom-filling operation. The resin is injected from the bottom of the module and simultaneously secures the image sensing device, illumination module, and other components in one process step, dramatically improving production efficiency while maintaining structural security.
Data Source
AI summary
An endoscopic light source image module comprises a substrate, an image sensor, an illumination module and a single-use mold. The image sensor, the illumination module and the single-use mold are disposed on the substrate. The illumination module includes a carrier disposed on the substrate and a light source disposed on the carrier, wherein the carrier is used to determine the height of the light source. The single-use mold has a first through-hole, a second through-hole and a runner, wherein the first through-hole accommodates the image sensor; the second through-hole accommodates the illumination module; the runner interconnects the first through-hole and the second through-hole. The single-use mold is made of an opaque material, which can prevent the light of the illumination module from affecting the image sensor.