Energy Ray-Curable Polymer for Semiconductor Wafer Adhesion
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Solution Overview
Problem
Energy ray-curable adhesive compositions used in semiconductor wafer processing face issues with low molecular weight compounds volatilizing during drying, leading to insufficient curing, adhesive residue, and contamination, especially during heat treatments or dicing processes.
Innovation Solution
Development of an energy ray-curable polymer with a radical generating group and an energy ray-polymerizable group bonded to the main chain or side chain, which reduces the amount of low molecular weight compounds, thereby minimizing volatilization and adhesive residue, and incorporating a phenyl carbonyl group with substituents for improved curing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If low molecular weight energy ray-curable resin is blended with photo polymerization initiator to form adhesive agent, then adhesive force during processing is improved, but insufficient curing occurs and low molecular weight substances remain unreacted causing contamination
Solution Approach 1:
The patent changes the molecular weight parameter of the energy ray-curable resin from low molecular weight to high molecular weight (number average molecular weight of 10,000 to 1,000,000). This parameter change ensures that the resin molecules are large enough to provide strong adhesive force while being too large to remain unreacted or cause contamination, thereby resolving the contradiction between adhesive strength and curing completeness.
2Ease of operation
If low molecular weight compounds are present in adhesive layer, then adhesive performance is improved, but volatile component generation during heat treatment occurs
Solution Approach 1:
The patent changes the molecular weight parameter of the energy ray-curable resin to high molecular weight (number average molecular weight of 10,000 to 1,000,000). High molecular weight compounds have lower vapor pressure and reduced volatility compared to low molecular weight compounds. This parameter change eliminates volatile component generation during heat treatment while maintaining adhesive performance through the high molecular weight resin's inherent adhesive properties.
3Strength
If energy ray-curable adhesive sheet is used for wafer processing, then strong adhesion during processing is achieved, but adhesive residue remains on wafer after release
Solution Approach 1:
The patent changes the molecular weight parameter of the energy ray-curable resin to high molecular weight (number average molecular weight of 10,000 to 1,000,000). High molecular weight polymers provide strong adhesive force during processing due to their chain entanglement and molecular weight-dependent adhesion mechanisms. After energy ray curing, the crosslinked high molecular weight network provides strong bonding that prevents residue formation, thereby resolving the contradiction between strong adhesion and residue-free release.
4Strength
If low molecular weight substances are included in adhesive layer, then initial adhesive strength is improved, but composition changes occur during drying process
Solution Approach 1:
The patent changes the molecular weight parameter of the energy ray-curable resin to high molecular weight (number average molecular weight of 10,000 to 1,000,000). High molecular weight substances have lower volatility and higher thermal stability compared to low molecular weight substances. This parameter change prevents compositional changes during the drying process while maintaining initial adhesive strength through the high molecular weight resin's inherent adhesive properties, thereby resolving the contradiction between initial strength and compositional stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Significantly reduces the amount of low molecular weight compounds in the adhesive layer, preventing compositional changes and volatile gas generation, ensuring reliable adhesion and easy release without residue, even under heat and water exposure during semiconductor processing.
Implementation Method 1
having a radical generating group capable of initiating polymerization reaction under the excitation by an energy ray
Data Source
AI summary
In a pressure-sensitive adhesive composition or a pressure-sensitive adhesive sheet containing an energy ray-curable polymer, problems associated with the volatilization of a low molecular weight compound contained in the composition are overcome. An energy ray-curable polymer characterized by comprising a radical generating group, which is capable of initiating a polymerization reaction upon excitation with an energy ray, and an energy ray-polymerizable group bonded together in the main or side chain.