Enlarged Die Paddle IC Package for Thermal Management
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Solution Overview
Problem
Smaller integrated circuit packages face challenges in heat dissipation, which can damage the chips and underlying systems, and existing solutions that increase package size counteract the trend of reducing component size.
Innovation Solution
The integrated circuit package design features an enlarged die paddle extending between the top and bottom surfaces, acting as a built-in heat sink, and leads extending between the surfaces to enhance thermal management, while also allowing for easy removal from a circuit board by exposing metal for direct heating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the package size is reduced to minimize real estate requirements, then the area occupied by the package is decreased, but the heat dissipation efficiency deteriorates
Solution Approach 1:
The die paddle is configured to extend between the top and bottom surfaces of the package, utilizing the vertical dimension to increase thermal dissipation surface area without expanding the package footprint. This dimensional transition allows heat to be conducted through the die paddle to both the top and bottom exterior surfaces, effectively doubling the heat dissipation pathways while maintaining a compact form factor.
2Temperature
If the die paddle is enlarged to improve heat dissipation, then the thermal management capability is improved, but the package volume increases
Solution Approach 1:
The die paddle extends vertically through the package from top to bottom surface, transforming the thermal management approach from horizontal expansion to vertical penetration. This allows the die paddle to serve as a through-conductor for heat extraction while maintaining a compact package footprint, effectively utilizing the Z-axis dimension rather than expanding the X-Y plane area.
3Temperature
If the die paddle extends between top and bottom surfaces to act as heat sink, then the heat dissipation is improved, but the manufacturing complexity increases
Solution Approach 1:
The die paddle serves multiple functions simultaneously: it provides mechanical support for the die, establishes electrical connections through the package, and acts as a thermal conduction pathway to both exterior surfaces. By integrating these multiple functions into a single structural element, the design reduces the need for separate components and simplifies the overall manufacturing process despite the through-extending geometry.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves heat dissipation and simplifies the removal process of defective chips without requiring additional board space, maintaining the compactness of the package while ensuring effective thermal management.
Implementation Method 1
The die paddle also may support and be in thermal contact with a heat sink along the top surface of the system
Implementation Method 2
at least a first portion of the die paddle is exposed to the top surface, while at least a second portion of the die paddle is exposed to the bottom surface
Data Source
AI summary
An integrated circuit package system having a body with a top surface, a bottom surface, and a plurality of side surfaces has a leadframe and encapsulating material that encapsulates at least a portion of the leadframe. The leadframe and encapsulating material are part of the body. The leadframe has a die paddle for supporting a die, and a plurality of leads spaced from the die paddle. The encapsulating material thus also separates the die paddle from the plurality of leads. At least a first portion of the die paddle is exposed to the top surface, while at least a second portion of the die paddle is exposed to the bottom surface.