Entangled Vertical Interconnects for Misaligned Die-to-Interposer Routing
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Solution Overview
Problem
Existing IC packages face challenges in providing signal routing paths between dies with misaligned and differently pitched interconnects, leading to increased complexity and congestion in the interposer substrate, necessitating larger areas and additional metallization layers.
Innovation Solution
The implementation of entangled vertical interconnects, such as angled wire bonds, in the die package's mold layer, which are coupled to both the routing substrate and interposer substrate, allowing for signal routing paths without requiring alignment or matching pitches between interconnects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If entangled interconnects are provided in the interposer substrate to connect misaligned interconnects, then signal routing paths between dies with different pitches are enabled, but the interposer substrate area and number of metallization layers increase
Solution Approach 1:
Instead of providing entangled interconnects in the interposer substrate to handle misalignment, the patent inverts the approach by providing entangled vertical interconnects in the mold layer of the die package. This transfers the entanglement complexity from the interposer substrate to the mold layer, allowing the interposer substrate to use simpler, more direct interconnect paths.
Solution Approach 2:
The patent moves the entanglement function from the horizontal plane (interposer substrate metallization layers) to the vertical dimension (mold layer with angled vertical interconnects). By using vertical interconnects that extend at angles through the mold layer, the patent achieves misalignment compensation in the vertical dimension rather than through complex horizontal routing.
2Quantity of substance
If the pitch of vertical interconnects is reduced to accommodate increased I/O pins, then more I/O pins can be connected, but the aspect ratio of vertical interconnects increases making fabrication difficult
Solution Approach 1:
The patent introduces dynamic flexibility in the vertical interconnect orientation by allowing them to extend at various angles rather than strictly vertically. This angular flexibility enables the interconnects to reach misaligned targets without requiring reduced pitch, thereby maintaining manageable aspect ratios while accommodating increased I/O pin counts.
3Ease of manufacture
If straight vertical interconnects are used, then fabrication is simpler, but misaligned interconnects between dies cannot be connected
Solution Approach 1:
The patent introduces the mold layer as an intermediary between the routing substrate and interposer substrate. This mold layer contains the entangled vertical interconnects that act as mediators, bridging the alignment gap between misaligned interconnects on different substrates while maintaining simple fabrication processes.
Data Source
AI summary
Die package with entangled vertical interconnects coupled to a routing substrate for reduced routing substrate layers, and related IC packages and fabrication methods are disclosed. The die package includes a first die coupled to a routing substrate to provide signal routing paths to the first die. The die package includes entangled vertical interconnects coupled to metal interconnects in the routing substrate, which are angled metal interconnects with respect to the extending direction of the coupled metal interconnects. The entangled vertical interconnects can be coupled to respective metal interconnects in an interposer substrate to provide a signal routing path between the die package and the interposer substrate as part of an IC package. In this manner, it is not necessary for the interposer substrate or the routing substrate of the first die package to have entangled interconnects for interconnections between unaligned metal interconnects in the interposer substrate and the routing substrate.