Co-Located Envelope Tracking Drivers for Linear mmWave Power Amplifiers

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Solution Overview

Problem

Mobile communication devices face increased power consumption and thermal dissipation due to higher output power requirements for RF signals, compromising performance and user experience, especially with the adoption of advanced wireless communication technologies like LTE and 5G-NR.

Innovation Solution

A multi-amplifier envelope tracking (ET) circuit and apparatus that concurrently amplifies RF signals using ET voltages and low-frequency currents, with driver circuits co-located with amplifier circuits to improve efficiency and linearity, particularly at higher modulation bandwidths, ensuring efficient power management and reduced thermal dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If sophisticated power amplifiers are employed to increase output power of RF signals, then data rates are improved, but power consumption and thermal dissipation increase

Engineering Contradiction:
Improvedata rateVSAvoidpower consumption
Core Design Contradiction:
ProductivityVSUse of energy by moving object

Solution Approach 1:

The patent implements dynamic voltage adjustment through envelope tracking, where the supply voltage to power amplifiers is continuously modulated to match the instantaneous signal envelope. This dynamic operation allows amplifiers to operate at optimal efficiency points across varying signal conditions, reducing overall power consumption while maintaining high data rate capability

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The system changes the operating parameters of power amplifiers by applying time-variant voltages that track the signal envelope. This parameter modulation enables the amplifiers to maintain high efficiency across different output power levels, thereby reducing power consumption without sacrificing data rate performance

Inventive Principle:
Principle #35Parameter changes

2Productivity

If sophisticated power amplifiers are employed to increase output power of RF signals, then data rates are improved, but thermal dissipation increases

Engineering Contradiction:
Improvedata rateVSAvoidthermal dissipation
Core Design Contradiction:
ProductivityVSTemperature

Solution Approach 1:

By dynamically adjusting the supply voltage to match the signal envelope in real-time, the system minimizes the voltage difference across amplifier devices during low-signal periods, thereby reducing power dissipation and thermal generation while maintaining high data rate capability during peak transmission

Inventive Principle:
Principle #15Dynamics

3Reliability

If driver circuits are co-located with amplifier circuits, then efficiency and linearity are improved, but device complexity increases

Engineering Contradiction:
ImprovelinearityVSAvoidcircuit complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges driver circuits with amplifier circuits into integrated units, where each amplifier has its dedicated co-located driver. This integration improves efficiency and linearity by minimizing signal path length and impedance mismatches, while the modular nature of the integration keeps the overall device complexity manageable

Inventive Principle:
Principle #5Merging (Combining)

4Power

If multiple amplifier circuits amplify RF signals concurrently, then output power is improved, but power consumption increases

Engineering Contradiction:
Improveoutput powerVSAvoidpower consumption
Core Design Contradiction:
PowerVSUse of energy by moving object

Solution Approach 1:

The system segments the power amplification function into multiple parallel amplifier circuits, each handling a portion of the total output power requirement. By applying envelope tracking to each amplifier individually, the system ensures that each segment operates at high efficiency, thereby achieving high total output power without proportionally increasing overall power consumption

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS11088659B2Multi-amplifier envelope tracking circuit and related apparatus
Publication Date: 2021.08.10 QORVO US INC
  • US11088659B2 patent drawing
  • US11088659B2 patent drawing
  • US11088659B2 patent drawing

AI summary

A multi-amplifier envelope tracking (ET) circuit and related apparatus are provided. The multi-amplifier ET circuit includes a number of amplifier circuits configured to amplify concurrently a radio frequency (RF) signal to generate a number of amplified RF signals for concurrent transmission, for example, in a millimeter wave (mmWave) spectrum. The amplifier circuits are configured to amplify the RF signal based on a number of ET voltages and a number of low-frequency currents, respectively. A number of driver circuits is provided in the multi-amplifier ET circuit to generate the ET voltages and the low-frequency currents for the amplifier circuits, respectively. In examples discussed herein, the driver circuits are co-located with the amplifier circuits to help improve efficiency and maintain linearity in the amplifier circuits, particularly when the RF signal is modulated at a higher modulation bandwidth (e.g., >80 MHz).