Envelope Tracking Circuit for Multi-PA Footprint and Heat Reduction
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Solution Overview
Problem
Mobile communication devices face increased power consumption and thermal dissipation when employing multiple power amplifiers for mmWave RF signals, leading to complexity and heat issues, particularly when supporting RF beamforming without a corresponding increase in envelope tracking (ET) circuits.
Innovation Solution
An ET circuit with a target voltage circuit, a supply voltage circuit, and an ET voltage circuit generates ET modulated voltages based on target and constant voltages to adapt to the power levels and impedances of multiple RF signals, allowing for improved linearity and efficiency while reducing the footprint and heat dissipation by using a single ET circuit for multiple amplifier circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple ET circuits are employed to support multiple power amplifiers for RF beamforming, then the power amplifier efficiency and linearity are improved, but the device footprint and complexity increase
Solution Approach 1:
The patent combines multiple ET circuits into a single integrated ET circuit that can simultaneously provide multiple ET modulated voltages to multiple power amplifiers. This merging approach maintains the efficiency and linearity benefits of envelope tracking for each amplifier while reducing the overall device footprint and complexity by eliminating redundant circuit components.
Solution Approach 2:
The single ET circuit is designed with multi-functionality to serve multiple power amplifiers simultaneously. It includes multiple target voltage circuits, supply voltage circuits, and ET voltage circuits that can generate separate ET modulated voltages for each amplifier, allowing one circuit to perform the work of multiple circuits while maintaining individualized control for each amplifier.
2Reliability
If multiple ET circuits are used to provide individual voltage control for each power amplifier, then the linearity and efficiency are improved, but the heat dissipation increases
Solution Approach 1:
By merging multiple ET circuits into a single integrated circuit, the patent reduces the total number of active components generating heat. The consolidated design allows for better thermal management and heat dissipation while maintaining the individualized voltage control necessary for each power amplifier's linearity and efficiency.
3Area of stationary object
If a single ET circuit is used to reduce footprint and complexity, then the device size is reduced, but the ability to adapt to different power levels and impedances of multiple RF signals is compromised
Solution Approach 1:
The single ET circuit incorporates multiple target voltage circuits, each capable of generating ET target voltages adapted to the specific power levels and impedances of different RF signals. This multi-functional design allows the circuit to maintain adaptability to various operating conditions while keeping a compact footprint.
Solution Approach 2:
The ET circuit is segmented into multiple independent functional blocks (target voltage circuits, supply voltage circuits, ET voltage circuits) that can independently adapt to different power levels and impedances. This segmentation within a unified structure enables customized adaptation for each RF signal while maintaining overall circuit integration and compact size.
Data Source
AI summary
An envelope tracking (ET) circuit and related power amplifier apparatus is provided. An ET power amplifier apparatus includes an ET circuit and a number of amplifier circuits. The ET circuit is configured to provide a number of ET modulated voltages to the amplifier circuits for amplifying concurrently a number of radio frequency (RF) signals. The ET circuit includes a target voltage circuit for generating a number of ET target voltages adapted to respective power levels of the RF signals and/or respective impedances seen by the amplifier circuits, a supply voltage circuit for generating a number of constant voltages, and an ET voltage circuit for generating the ET modulated voltages based on the ET target voltages and a selected one of the constant voltages. By employing a single ET circuit, it may be possible to reduce footprint and improve heat dissipation of the ET power amplifier apparatus.