Environmental Sensor Assembly with Symmetric Inlets for Fast Response
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Solution Overview
Problem
Environmental sensors face challenges in achieving fast response times due to gas diffusion through the sensor casing, thermal imbalances between sensing and reference regions, and exposure to external contaminants, which affect accuracy and integration in space-constrained applications.
Innovation Solution
The environmental sensor assembly features a package with symmetrically arranged inlets providing a short diffusion path for gas molecules to the sensing region while maintaining thermal homogeneity between the sensing and reference regions, isolated from external contaminants, and includes a compact design for easy integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the sensor is placed inside a protective package, then the sensor is protected from external contaminants and interference, but the response time increases due to longer gas diffusion path
Solution Approach 1:
The package is segmented into multiple chambers (sensing chamber and reference chamber) with controlled openings, allowing selective gas flow paths that protect the sensor while enabling rapid response through optimized diffusion channels
Solution Approach 2:
A protective membrane or filter structure acts as an intermediary between the external environment and the sensor, allowing gas molecules to pass through while blocking contaminants, thus maintaining both protection and fast response
2Measurement precision
If a reference region is added to the sensor, then measurement accuracy improves, but the device dimensions increase
Solution Approach 1:
The sensing region and reference region are merged into a single integrated sensor chip with shared structural elements and common packaging, reducing overall device volume while maintaining dual-region functionality for accurate measurements
Solution Approach 2:
The reference chamber is nested within or adjacent to the sensing chamber structure, with both regions sharing common package walls and infrastructure, thereby minimizing the total volume occupied by the dual-region sensor
3Loss of time
If the inlets are arranged to provide short diffusion path, then response time improves, but thermal balance between sensing and reference regions becomes difficult to maintain
Solution Approach 1:
The package employs asymmetric thermal design where the sensing and reference chambers have different thermal conductivities or heat capacity distributions, allowing short diffusion paths while compensating for thermal imbalances through differential thermal management
Solution Approach 2:
Different regions of the package are assigned different thermal properties - the sensing region may have enhanced thermal coupling to the reference region through localized thermal pathways, while maintaining short gas diffusion paths through optimized inlet geometry
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables fast and accurate sensing with reduced thermal and environmental interference, enhancing sensitivity and ease of integration in various systems.
Implementation Method 1
by providing a short diffusion path for target (e.g. gas) molecules to diffuse from outside a package inlet to the sensing region
Implementation Method 2
maintaining thermal homogeneity between the sensing and reference regions
Implementation Method 3
by exploiting convection and buoyancy
Data Source
AI summary
An environmental sensor assembly comprising: a package; and an environmental sensor disposed in the package, the environmental sensor comprising a sensing region and a reference region; wherein the package comprises one or more inlets arranged symmetrically with respect to the sensing region and the reference region; and wherein the sensing region is in fluid communication with an external environment through the one or more inlets. A method of manufacturing an environmental sensor assembly is also described.