Electro-Osmotic Cooling Loop With Gas Accumulation for Electronics
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Solution Overview
Problem
There is a need for improved systems and methods to effectively cool electronic devices as they generate increasing amounts of heat.
Innovation Solution
A method involving an electro-osmotic (EO) pump to circulate a working fluid, a gas accumulator to collect gas produced during operation, a heat exchanger to radiate heat, and a core in thermal communication with electronic components, utilizing thermal fittings for leak-proof seals and channels to facilitate efficient heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional liquid cooling system is used to cool electronic components, then heat dissipation is achieved, but gas production leads to cavitation and reduced system reliability
Solution Approach 1:
The patent converts the harmful gas production from electrolysis into a beneficial feature by allowing the gas to rise and form a natural barrier layer that reduces heat transfer resistance. The gas accumulation that would normally cause cavitation and reliability issues is instead utilized to improve thermal management efficiency.
2Speed
If an electro-osmotic pump is used to circulate working fluid, then pumping is achieved, but gas is produced through electrolysis
Solution Approach 1:
The patent transforms the harmful gas byproduct of electrolysis in the electro-osmotic pump into a beneficial thermal management feature. The gas bubbles rise and form a natural barrier layer that reduces heat transfer resistance, converting a reliability issue into a performance enhancement.
Solution Approach 2:
The patent changes the physical state and distribution of gas in the system by allowing it to accumulate and form a barrier layer rather than dispersing it. This parameter change from dispersed gas bubbles to concentrated barrier layer transforms the harmful effect into a beneficial thermal management mechanism.
3Reliability
If thermal fittings are used to connect components, then leak-proof seals are achieved, but assembly complexity increases
Solution Approach 1:
The patent combines the sealing function and thermal conduction function into a single integrated thermal fitting component. This merging eliminates the need for separate seal elements and simplifies the assembly process while maintaining leak-proof integrity and efficient heat transfer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively reduces gas production, mitigates cavitation and electrode erosion, and enhances heat dissipation from electronic components, ensuring efficient cooling.
Implementation Method 1
applying an electrical current to the EO pump to cause the working fluid to circulate in a fluid circuit
Implementation Method 2
providing a heat exchanger to radiate heat away from the working fluid
Implementation Method 3
providing a heat exchanger to radiate heat away from the working fluid
Implementation Method 4
providing a core configured to be in thermal communication with at least one electronic component that generates heat
Data Source
AI summary
Disclosed are systems and methods for facilitating the cooling of electronic devices. In one embodiment, a cooling method includes pumping a working fluid with an electro-osmotic (EO) pump through a fluid circuit; collecting a gas produced from the operation of the EO pump upon the working fluid—the collection of gas inducing a saturation of the gas in the fluid circuit; and radiating heat from the working fluid via a heat exchanger. In some embodiments, the method involves providing a core having channels for transporting the working fluid, and placing the core in thermal communication with electronic components that generate heat. The core is placed in fluid communication with the EO pump. In certain embodiments, the core, EO pump, gas collector, and heat exchanger are coupled to provide a substantially leak proof system that does not allow gas molecules to escape from the fluid circuit.